HomeNewsIndia NewsFirst System Basis Chips introduced, allowing High Speed Communication

    First System Basis Chips introduced, allowing High Speed Communication

    Infineon Technologies announces the launch of two new System Basis Chip (SBC) families: Lite and Mid-Range+. Infineon says it to be the first SBCs on the market supporting the ISO CAN FD protocol for communication at 5 Mbit/s for a large variety of automotive applications.

    An SBC is the central supply of power and communication for microcontrollers within electronic control units (ECU) in cars. SBCs are integrated circuits (IC) that combine voltage supplies, communication bus interfaces (CAN, LIN) and supervision features.

    The combination of these three elements in one chip leads to lower system costs and up to 80 percent smaller design footprint compared to discrete solutions.

    The new Infineon Lite SBCs are the entry level SBCs at optimized system costs.

    They incorporate one CAN transceiver to address a broad range of applications such as in-cabin wireless charger, NO x sensor, gear shifter or light control units.

    The Mid-Range+ SBCs from Infineon are more powerful devices with one CAN and up to two LIN transceivers to support e.g. body control modules and gateway modules.

    In addition to high-speed communication, the new Infineon SBCs allow:

    • A lower power consumption.
    • With their optional partial networking feature they reduce current consumption by putting the ECU in a sleep or stop mode when it is not needed.
    • The Lite SBC family also features a charge pump to drive high side n-channel power MOSFETs. It can disconnect an external load during sleep mode in order to further reduce quiescent current.
    • All devices of the new SBC families include diagnostic and supervision features to support ECU functional safety concepts like under-voltage monitoring, window watchdog with reset, fail-safe operating mode and fail-safe output.
    • Moreover, with the Mid-Range+ family external loads can be driven by four high-side switches.
    • The new Infineon SBCs offer high flexibility to designers.

    They are scalable regarding the number of communication interfaces and are software compatible with other Infineon SBC families such as the DCDC and Multi-CAN Power SBC families (TLE94x1, TLE926x & TLE927x).

    ELE Times Research Desk
    ELE Times Research Deskhttps://www.eletimes.ai
    ELE Times provides a comprehensive global coverage of Electronics, Technology and the Market. In addition to providing in depth articles, ELE Times attracts the industry’s largest, qualified and highly engaged audiences, who appreciate our timely, relevant content and popular formats. ELE Times helps you build awareness, drive traffic, communicate your offerings to right audience, generate leads and sell your products better.

    Related News

    Must Read

    Arrow Electronics and Infineon introduce 240W USB-C PD 3.2 reference design for battery-powered motor control applications

    Arrow Electronics and Infineon Technologies AG have announced REF_ARIF240GaN, a...

    Robotics Engineering: The Architectural Evolution Behind IT–OT Convergence

    Factories today operate as dense mechanical ecosystems, whether in...

    How AI Is Transforming Network Protocol Testing in Software-Defined Networks?

    As enterprises accelerate toward cloud-native infrastructure, edge computing, and...

    What is Fashion Tech? Providing New Product Value and Customer Experiences with Technology

    Courtesy: Murata Electronics What is fashion tech? - diverse technologies...

    Emergency Screaming Detection: How AI Recognizes Human Screams and Saves Lives

    Courtesy: Renesas Detecting human screams for help is important in...

    India’s Electronics Push: Ambition Is Clear. Execution Will Decide the Outcome

    India’s electronics story has entered a decisive phase. The...

    India on the Road to Semicon Self-Reliance with Three More Plants

    India to welcome three more semiconductor plants after PM...

    Upcoming years to Bring Boom for Semiconductors and Electronics

    Union Minister for Electronics and Information Technology Ashwini Vaishnaw...

    R&S Propels 6G Readiness With FR1–FR3 Carrier Demonstration

    Rohde & Schwarz and Qualcomm Technologies, Inc. have reached...

    ROHM and Suchi Semicon Establish a Strategic Semicon Manufacturing Partnership in India

    ROHM and Suchi Semicon have announced the establishment of...