HomeNewsIndia NewsLatest Modular gateway computer introduced for DIN rail mounting

    Latest Modular gateway computer introduced for DIN rail mounting

    The MC50M is a modular gateway computer and part of the DIN rail family from MEN. The box is based on Intel’s Atom E3900 series with low power dissipation and scalability in performance and memory. The modular expansion concept makes the DIN rail family a cost-effective and flexible partner.

    Embedded system for IoT, security and predictive maintenance

    The MC50M is a modular DIN rail box PC for embedded applications in transportation. The computer platform is based on Intel’s Atom E3900 CPU series. This makes the MC50M the ideal basis for functions such as security gateway, predictive maintenance, CCTV, ticketing systems or as a diagnostic server.

    Modularity and railway conformity

    The MC50M can be used as a stand-alone product or in combination with a range of pre-fabricated extension modules, providing additional features and short delivery times.
    Extension modules can provide application-specific functions such as wireless communication (LTE advanced, WLAN, GNSS), MVB, CAN bus or other I/Os. A removable storage shuttle supports the integration of one to two 2.5″ SATA hard disks/SSDs. The wide range PSU allows isolated power supply from 24 V DC to 110 V DC nominal and extends the entire system to EN 50155 compliance.

    Power-saving design and safety

    The board management controller provides increased reliability and reduces downtime. The Trusted Platform Module supports security and encryption features. With the ignition switch for remote startup and shutdown control, the platform provides additional energy saving features.

    Robust and future-proof

    The aluminum housing with cooling fins ensures conductive cooling and fanless operation. The MC50M has no moving parts, so it can be operated maintenance-free.

    DIN Rail: Flexible configuration in a modular system

    MEN’s DIN rail concept is designed for flexible configuration of module combinations and is suitable for embedded IoT applications in various markets. The CPU modules can be flexibly combined with various expansion modules and power supplies.

    The concept specifications include housing dimensions, mounting, cooling and IP protection. In addition, the expansion connectors and their pin assignment are defined.
    DIN rail mounting (35 mm) is standard. Wall and 19” rack mounting is possible using adaption brackets.

    ELE Times Research Desk
    ELE Times Research Deskhttps://www.eletimes.ai
    ELE Times provides a comprehensive global coverage of Electronics, Technology and the Market. In addition to providing in depth articles, ELE Times attracts the industry’s largest, qualified and highly engaged audiences, who appreciate our timely, relevant content and popular formats. ELE Times helps you build awareness, drive traffic, communicate your offerings to right audience, generate leads and sell your products better.

    Related News

    Must Read

    Qualitas Semiconductor Picks Anritsu’s Vector Network Analyzer for High-Speed Interconnect Signal Integrity Verification

    Qualitas Semiconductor Co., Ltd., a leading developer specialising in...

    The Tomorrow for AI and India’s edge advantage

    Courtesy: Qualcomm Artificial intelligence is entering its next chapter, one...

    Posifa Technologies Introduces PVC4001-C MEMS Pirani Vacuum Transducer for Wide-Range Vacuum Measurement

    Posifa Technologies has introduced its new PVC4001-C MEMS Pirani vacuum...

    STMicroelectronics to support AI infrastructure demand with high-volume production of its industry-leading silicon photonics platform

    STMicroelectronics is now entering high-volume production for its state-of-the-art...

    Impact of AI on Computing and the Criticality of Testing

    Courtesy: Teradyne Artificial intelligence (AI) is transforming industries, enhancing our...

    Disruptions from Wide Bandgap Continue Turbulence

    Courtesy: Avnet When we experience major shifts in the technology...

    Securing Humanoid Robotics with TPM-Anchored FPGAs

    Courtesy: Lattice Semiconductor The humanoid robotics market is rapidly transitioning...

    Keysight Expands Digital‑Layer Error Performance Validation for High‑Speed 1.6T Interconnects in AI Data Centres

    Keysight Technologies, Inc. introduced the Functional Interconnect Test Solutions (FITS) portfolio...

    CEA-Leti and NcodiN Collaborate on 300 mm Silicon Photonics for Bandwidth-Consuming AI Interconnects

    CEA-Leti and NcodiN, a French deep-tech startup pioneering nanolaser-enabled...