HomeNewsIndia NewsMSIPS Benefited Companies Invested Rs. 3,585 Crore in 72 Electronics Manufacturing Projects

    MSIPS Benefited Companies Invested Rs. 3,585 Crore in 72 Electronics Manufacturing Projects

    Electronic firms shortlisted for incentives by the government for manufacturing their products in India have invested Rs 3,585 crore in 72 projects up until September this year, Parliament was informed on December 20, 2017.

    “As per the reports provided by the applicants approved under MSIPS, as on 30-09-2017, a total of Rs 3,585 crore has been invested in 72 projects resulting in employment generation of 27,804 persons (direct and indirect),” Minister of State for Electronics and IT Alphons Kannanthanam said.

    In a written reply to the Lok Sabha, he said the government has approved 134 applications under Modified Special Incentive Package Scheme (MSIPS) to date.

    The MSIPS scheme provides a subsidy for capital expenditure — 20 percent for investments in special economic zones (SEZs) and 25 percent in non-SEZs.

    “So far, under the MSIPS scheme, incentives of Rs 122.06 crore have been disbursed to the 11 applicants, out of which, the capex subsidy is Rs 113.94 crore and tax reimbursement is Rs 8.13 crore,” Kannanthanam said.

    Out of the total, highest investment of Rs 1,034.31 crore has been made in Maharashtra generating 3,643 direct and indirect employment. The investment of Rs 254.46 crore in Tamil Nadu created the highest employment of 8,671 people under the scheme.
    ELE Times Research Desk
    ELE Times Research Deskhttps://www.eletimes.ai
    ELE Times provides a comprehensive global coverage of Electronics, Technology and the Market. In addition to providing in depth articles, ELE Times attracts the industry’s largest, qualified and highly engaged audiences, who appreciate our timely, relevant content and popular formats. ELE Times helps you build awareness, drive traffic, communicate your offerings to right audience, generate leads and sell your products better.

    LEAVE A REPLY

    Please enter your comment!
    Please enter your name here

    Related News

    Must Read

    Optimized analog front-end design for edge AI

    Courtesy: Avnet Key Takeaways: 01.   AI models see data differently: what...

    Introducing Wi-Fi 8: The Next Boost for the Wireless AI Edge

    Courtesy: Broadcom Wi-Fi 8 has officially arrived—and it marks a...

    Vehicle to Grid (V2G) Charging in EVs: Understanding the Basics

    Much of the research around emerging technologies in Electric...

    Asia-Pacific Takes the Lead in AI Adoption Across Manufacturing

    Courtesy: Rockwell Automation Manufacturing around the world has undergone a...

    STMicroelectronics streamlines smart-home device integration with industry-first Matter NFC chip

    STMicroelectronics has unveiled a secure NFC chip designed to...

    Mitsubishi Electric India to Showcase Breakthrough Power Semiconductor Technologies at PCIM India 2025

    Mitsubishi Electric India, is set to introduce its flagship...

    ASMPT Wins New Orders for Nineteen Chip-to-Substrate TCB Tools to Serve AI Chip Market

    ASMPT announced it had won new orders for 19...

    Microchip Halves the Power Required to Measure How Much Power Portable Devices Consume

    Battery-operated devices and energy-restricted applications must track and monitor...