Technology

New soft starter modules: One foot-print fits a broad range of current classes

Infineon Technologies Bipolar GmbH & Co. KG is launching Infineon Power Start designed for low voltage soft starter applications. The new module family meets...

Digital control meets intelligent analog to streamline design

Whether it’s used as an initial introduction into embedded development, the main controller of a connected application or as an attached component to offload...

Fortinet Delivers Third Generation of Network Security with the Evolution of its Security Fabric

Fortinet announced at its global partner and user conference, Accelerate 18, the evolution of its Security Fabric architecture with the release of FortiOS 6.0,...

TI expands GaN power portfolio with the industry’s smallest and fastest GaN drivers

Expanding on its industry-leading gallium nitride (GaN) power portfolio, Texas Instruments (TI) announced two new high-speed GaN field-effect transistor (FET) drivers to create more efficient,...

NFC (Near Field communication) in Automotive

Near Field communication (NFC), a bidirectional short range communication technology, allows an interaction distance of few centimeter and a maximum data rate of 424...

Renesas Synergy Strengthens Chip-to-Cloud IoT Connectivity with New Enterprise Cloud Toolbox

Renesas Electronics Corporation announced the new Renesas Synergy Enterprise Cloud Toolbox v1.1 -- a software Application Project that together with the Synergy AE-CLOUD1 kit...

Lowest-power multi-standard, multi-band MCUs connect the building, factory and grid via Thread, Zigbee, Bluetooth 5...

To meet growing connectivity needs for buildings, factories and the grid, Texas Instruments (TI) introduced its newest SimpleLink wireless and wired microcontrollers (MCUs). These...

New 1-MHz active clamp flyback chipset and industry-first 6-A three-level buck battery charger cut power...

Texas Instruments (TI) introduced several new power management chips that enable designers to boost efficiency and shrink power-supply and charger solution sizes for personal...

Leti and Mapper Develop Individualized Chips with Maskless Lithography in CMOS Process

Leti, a research institute of CEA Tech, and Mapper Lithography, the leading provider of maskless lithography equipment for the semiconductor and nanofabrication industries, today announced...

congatec introduces MIPI-CSI 2 Smart Camera Kit for Rugged Vision Systems

congatec introduced its first MIPI-CSI 2 Smart Camera Kit for vision systems at the edge of the IIoT. It is an application-ready kit for the...

Radware Neutralizes Evasive Zero-Day Malware Threats with Cloud Malware Protection Service

Radware launched its Cloud Malware Protection Service, built to detect, alert and block upon evasive zero-day malware that eludes existing anti-malware defenses and steal...

Wolfspeed’s High-Efficiency GaN HEMTs, Now at Mouser

Mouser Electronics, is now stocking the CG2H40xx and CG2H30070 gallium-nitride (GaN) high-electron-mobility transistors (HEMTs) from Wolfspeed, a Cree company. Operating from a 28-volt rail,...

Vertiv to Provide Energy Savings as a Service to Telefónica

At Mobile World Congress today, Vertiv and Telefónica announced a global, long-term partnership to boost energy savings through fit-for-purpose infrastructure solutions. Under the agreement, Vertiv will...

Vehicle Communication: Infineon and Elektrobit Improve Data Security in the Car

New features in the car require electronic control units that are networked, with each other and the cloud. Embedded IT security is a vital...

Keysight Unveils Integrated Design and Test Solutions for Network Equipment Manufacturers

Keysight Technologies revealed the most comprehensive suite of 5G-related solutions and services at Mobile World Congress 2018. Keysight will be demonstrating new solutions that...

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