HomeNewsIndia To Launch Rs 12,000 Crore PLI Scheme For High-End IT, Mobile...

    India To Launch Rs 12,000 Crore PLI Scheme For High-End IT, Mobile Components

    The central government is planning to launch a production-linked incentive (PLI) scheme to promote domestic production of high-end smartphone components and other IT hardware in India.

    The scheme, under the Ministry of Electronics and Information Technology (MeitY), is expected to be worth around Rs 10,000 – 12,000 crore. Such a scheme will help develop a complete ecosystem of electronics manufacturing in India.

    Further, such an ecosystem will help attract global tech giants such as Apple to the country. The PLI scheme will also enable tech companies based in Asian hubs such as Japan, Taiwan, and Korea to migrate their manufacturing units towards India.

    Previously, India had launched the Scheme for Promotion of Manufacturing of Electronic Components and Semiconductors (SPECS) in April 2020 to promote the manufacturing of high-value-added electronic items such as touch panels and camera modules. Notably, SPECS comes to an end in March 2023 and the new PLI is expected to launch by then.

    The scheme may offer incentives on the production of components as well as capital support for setting up production facilities.

    The financial outlay of SPECS was around Rs 3,285 crore and it has led to investments worth Rs 12,000 crore so far, as per reports.

    ELE Times News
    ELE Times Newshttps://www.eletimes.ai/
    ELE Times provides extensive global coverage of Electronics, Technology, and the Market. In addition to providing in-depth articles, ELE Times attracts the industry’s largest, qualified, and highly engaged audiences, who appreciate our timely, relevant content and popular formats. ELE Times helps you build experience, drive traffic, communicate your contributions to the right audience, generate leads, and market your products favorably.

    Related News

    Must Read

    Keysight to Demonstrate NR-NTN devices Mobility Testing at MWC 2026 in Collaboration with Samsung

    Keysight Technologies, Inc. will demonstrate lab-based validation of new...

    ROHM Strengthens Supply Capability for GaN Power Devices

    Combining TSMC’s Process Technology to Build an End-to-End, In-Group...

    element14 Community launches smart security and surveillance design challenge

    element14, an Avnet Community, in collaboration with ADI, has...

    R & S and LITEON demonstrate high‑throughput 5G femtocell testing with the PVT360A

    Rohde & Schwarz and LITEON collaborate to showcase a...

    Infineon presents MCU and sensor solutions for the future of AI, IoT, mobility, and robotics

    Next-generation embedded systems are essential for applications in the...

    R&S advances AI-RAN testing using digital twins in collaboration with NVIDIA

    Rohde & Schwarz will showcase a new milestone in...

    Top Seven Tech Trends in the semiconductor sector for 2026

    By: STMicroelectronics In 2026, a new class of intelligent machines...