HomeNewsIndia Aims to Capture 10% of Global Chip Demand by 2030

    India Aims to Capture 10% of Global Chip Demand by 2030

    India is accelerating its semiconductor ambitions, aiming to secure 10% of global chip demand by 2030. Central to this strategy is the India Semiconductor Mission (ISM), launched in December 2022 with an allocation of ₹76,000 crore, designed to foster a sustainable semiconductor ecosystem and reduce reliance on imports.

    In a significant development, Tata Electronics and Taiwan’s PSMC have announced a joint venture to establish India’s first 12-inch wafer fabrication facility in Dholera, Gujarat. With an investment of $11 billion, this project is expected to generate over 20,000 jobs and focus on manufacturing power management ICs, display driver ICs, microcontrollers, and high-performance computing logic components.

    The 2025 budget reflects the government’s commitment, doubling the allocation for chip initiatives to ₹2,499.96 crore for FY26. This includes increased funding for compound semiconductors, sensors, and chip assembly/testing units, with a 56% rise to ₹3,900 crore, and nearly doubling the allocation for the design-linked incentive (DLI) to ₹200 crore.

    Strategic partnerships with countries like Singapore, the US, Japan, and Taiwan are also being pursued to enhance technology transfer, skill development, and foreign direct investment. These efforts position India as a key player in the global semiconductor supply chain, aligning with the ‘China Plus One’ strategy amid evolving geopolitical dynamics.

    Related News

    Must Read

    Keysight to Demonstrate NR-NTN devices Mobility Testing at MWC 2026 in Collaboration with Samsung

    Keysight Technologies, Inc. will demonstrate lab-based validation of new...

    ROHM Strengthens Supply Capability for GaN Power Devices

    Combining TSMC’s Process Technology to Build an End-to-End, In-Group...

    element14 Community launches smart security and surveillance design challenge

    element14, an Avnet Community, in collaboration with ADI, has...

    R & S and LITEON demonstrate high‑throughput 5G femtocell testing with the PVT360A

    Rohde & Schwarz and LITEON collaborate to showcase a...

    Infineon presents MCU and sensor solutions for the future of AI, IoT, mobility, and robotics

    Next-generation embedded systems are essential for applications in the...

    R&S advances AI-RAN testing using digital twins in collaboration with NVIDIA

    Rohde & Schwarz will showcase a new milestone in...

    Top Seven Tech Trends in the semiconductor sector for 2026

    By: STMicroelectronics In 2026, a new class of intelligent machines...