HomeNewsGovernment approves 17 projects worth Rs. 7,172 crore under ECMS

    Government approves 17 projects worth Rs. 7,172 crore under ECMS

    The Ministry of Electronics and IT announced for the clearance of 17 additional proposals, worth Rs. 7,172 crore under the Electronics Components Manufacturing Scheme (ECMS). The projects are expected to generate production worth Rs 65,111 crore and 11,808 direct jobs across the country, according to the ministry.

    The approved projects are spread across 9 states from Jammu and Kashmir to Tamil Nadu, focusing on the government’s commitment towards a ‘balanced regional growth’ and creation of high-skill jobs beyond metropolitan clusters.

    This approval focuses on developing key technologies used in various IT hardware, wearables, telecom, EVs, industrial electronics, defence, medical electronics, and renewable energy, like oscillators, enclosures, camera modules, connectors, Optical Transceiver (SFP), and multi-layered PCBs.

    Minister of Electronics and IT, Ashwini Vaishnaw highlighted that the next phase of value chain integration is being unravelled, from devices to components and sub-assemblies which will ensure that India’s electronics sector reaches $500 billion in manufacturing value by 2030–31.

    The Minister also launched the 1st Generation Energy-Efficient Edge Silicon Chip (SoC) (ARKA-GKT1), jointly developed by Cyient semiconductors Pvt Ltd and Azimuth AI along with the projects. The Platform-on-a-Chip SoC integrates advanced computing cores, hardware accelerators, power-efficient design, and secure sensing into a single chip, delivering up to 10x better performance while reducing cost and complexity. It supports smart utilities, cities, batteries, and industrial IoT, showcasing India’s shift toward a product-driven, high-performance semiconductor ecosystem.

    Related News

    Must Read

    BD Soft strengthens cybersecurity offerings for BFSI and Fintech businesses with advanced solutions

    BD Software Distribution Pvt. Ltd. has expanded its Managed...

    Advancing Quantum Computing R&D through Simulation

    Courtesy: Synopsys Even as we push forward into new frontiers...

    Overcoming BEOL Patterning Challenges at the 3-NM Node

    Courtesy: Lam Research ● Controlling critical process parameters is key...

    Driving Innovation with High-Performance but Low-Power Multi-Core MCUs

    Courtesy: Renesas Over the last decade, the number of connected...

    Evolving from IoT to edge AI system development

    Courtesy: Avnet The advancement of machine learning (ML) along with...

    From the grid to the gate: Powering the third energy revolution

    Courtesy: Taylor, Robert, Mannesson, Henrik, Texas Instruments A significant change...

    Rohde & Schwarz India Pvt. Ltd. unveils R&D Centre in New Delhi, India

    Rohde & Schwarz announced the expansion of its Research...

    Rohde & Schwarz presents multi-purpose R&S NGT3600 high-precision dual-channel power supply

    Rohde & Schwarz showcases at productronica 2025 the R&S...

    IEEE Wintechon 2025 Powering India’s Semiconductor Future through Data, Diversity and Collaboration

    The sixth edition of IEEE WINTECHCON 2025 convened over 800...

    Rohde & Schwarz collaborates with Broadcom to enable testing and validation of next-gen Wi-Fi 8 chipsets

    Rohde & Schwarz, deepened its collaboration with Broadcom Inc....