HomeIndustryAerospace and DefenceAVX at CMSE 2017 will Present & Exhibit components for Military &...

    AVX at CMSE 2017 will Present & Exhibit components for Military & Space Electronics

    AVX Corporation, a leading manufacturer of passive components and interconnect solutions, will deliver two technical presentations, teach a training seminar, and exhibit at the 21st annual Components for Military & Space Electronics Conference & Exhibition (CMSE 2017), which will take place April 11–13, 2017 at the Sheraton Four Points Hotel in Los Angeles.

    Recognized as the most comprehensive conference dedicated to successful practices for the use of both military and COTS components in military and space systems, CMSE addresses topics including: electronic components, testing, reliability, and supply chain, and places a special emphasis on new technology and design practices. The first day of CMSE 2017 will be comprised of four in-depth training seminars, one of which — Morning Session B, entitled “Multi-Layer Ceramic Capacitor Technology: Materials, Processes, and Reliability Considerations” — will be taught by AVX’s Ceramics Technical Manager, John Marshall, and will address capacitor materials and manufacturing processes, capacitor defect types and screening techniques, and BME capacitor design and evaluation for space applications. Days two and three of the event will feature exhibition hours and a total of five technical conference sessions, one of which (Session 2) will feature two AVX presentations and be chaired by AVX Fellow and member of the CMSE Program Committee, Ron Demcko.

    “We’re very pleased to have been invited to participate in and contribute to the CMSE conference and exhibition for the fifth consecutive year,” said AVX Fellow, Ron Demcko. “CMSE is an industry-shaping event created by engineers for engineers and product management, and provides an ideal environment for industry experts to share the latest information about military and space components. CMSE also allows attendees to collaborate with top component and design engineers, engineering and product managers, and quality assurance personnel and procurement executives to address and solve design and deployment issues pertaining to these critical devices, which is both unique and crucial to the future success of these markets.”

    On Wednesday, April 12, Ron Demcko will co-chair Session 2: Passive Components and Packaging Methods for Hi Rel/Space Applications, which will feature AVX Technical Marketing Manager Chris Reynolds’ presentation, “Tantalum Polymer Capacitors: COTS Plus Solutions for Space Applications,” as well as another presentation by John Marshall, entitled “Base Metal Ceramic Capacitors for High Reliability Applications.”

    For more information about the 2017 Components for Military & Space Electronics Conference & Exhibition, please visit:
    http://store.tjgreenllc.com/wp-content/uploads/2017/01/2017-CMSE-Program_sm.pdf to access the advanced conference program.

    ELE Times Bureau
    ELE Times Bureauhttps://www.eletimes.ai/
    ELE Times provides a comprehensive global coverage of Electronics, Technology and the Market. In addition to providing in depth articles, ELE Times attracts the industry’s largest, qualified and highly engaged audiences, who appreciate our timely, relevant content and popular formats. ELE Times helps you build awareness, drive traffic, communicate your offerings to right audience, generate leads and sell your products better.

    LEAVE A REPLY

    Please enter your comment!
    Please enter your name here

    Related News

    Must Read

    Optimized analog front-end design for edge AI

    Courtesy: Avnet Key Takeaways: 01.   AI models see data differently: what...

    Introducing Wi-Fi 8: The Next Boost for the Wireless AI Edge

    Courtesy: Broadcom Wi-Fi 8 has officially arrived—and it marks a...

    Vehicle to Grid (V2G) Charging in EVs: Understanding the Basics

    Much of the research around emerging technologies in Electric...

    Asia-Pacific Takes the Lead in AI Adoption Across Manufacturing

    Courtesy: Rockwell Automation Manufacturing around the world has undergone a...

    STMicroelectronics streamlines smart-home device integration with industry-first Matter NFC chip

    STMicroelectronics has unveiled a secure NFC chip designed to...

    Mitsubishi Electric India to Showcase Breakthrough Power Semiconductor Technologies at PCIM India 2025

    Mitsubishi Electric India, is set to introduce its flagship...

    ASMPT Wins New Orders for Nineteen Chip-to-Substrate TCB Tools to Serve AI Chip Market

    ASMPT announced it had won new orders for 19...

    Microchip Halves the Power Required to Measure How Much Power Portable Devices Consume

    Battery-operated devices and energy-restricted applications must track and monitor...