HomeNewsIndia NewsNew Grade of Seco End Mills Boosts Tool Life for Difficult Materials

    New Grade of Seco End Mills Boosts Tool Life for Difficult Materials

    New Jabro-Solid2 JS750 end mills from Seco boost tool life by 25 percent to 40 percent compared to previous tool technology. As counterparts to the company’s industry-leading JS500 series, the new JS754 and JS755 tools provide cost-effective high performance designed specifically for processing challenging materials typically found in the aerospace sector, including ISO M (stainless steel) and S (heat-resistant super alloys and titanium).

    Within the new series, the versatility of the various JS754 and JS755 cutter geometries optimizes conventional side milling, roughing and slotting, as well as advanced roughing and dynamic milling operations. The cutters’ smooth peripheral rake faces and strong radius design efficiently evacuate chips while keeping a true radius form. Increased front back tapers enhance speed and reliability when interpolating or ramping for pocket machining.

    The broad range of JS754 and JS755 tool variations and features ensures the highest cutting performance. With this new series of end mills, shops can match tool to application with various lengths, OD neck reduction sizes and corner radii, as well as chip splitters and through-coolant options.

    Range overview:

    • JS754: 4-flute side roughing, side finishing and slotting, APMXS=2*DC + OD
    – ø3-25 chamfer and radii offer RE0.2 0.5 1.0 1.5 2.0 3.0 4.0 6.0, normal length
    – ø6-20 chamfer ICC through coolant, normal length
    – ø10 and ø12 chamfer including chip splitters, normal length

    • JS754: 4-flute side roughing, side finishing, APMXS=3.5 – 4*DC + OD
    – ø6-25 chamfer and radii offer RE0.2 0.5 1.0 2.0 3.0 4.0 6.0, long length
    – ø10-20 chamfer including chip splitters, long length (advanced roughing)

    • JS755: 5-flute high volume side rough and side finishing, APMXS=2*DC + OD
    – ø6-25 chamfer and radii offer RE0.5 1.0 2.0 3.0 6.0, normal length

    • JS755: 5-flute high volume side roughing, side finishing, APMXS=3.5 – 4*DC + OD
    – ø6-25 chamfer and radii offer RE0.2 0.5 1.0 2.0 3.0 4.0 6.0, long length
    – ø10-20 chamfer including chip splitters, long length (advanced roughing)

    ELE Times Research Desk
    ELE Times Research Deskhttps://www.eletimes.ai
    ELE Times provides a comprehensive global coverage of Electronics, Technology and the Market. In addition to providing in depth articles, ELE Times attracts the industry’s largest, qualified and highly engaged audiences, who appreciate our timely, relevant content and popular formats. ELE Times helps you build awareness, drive traffic, communicate your offerings to right audience, generate leads and sell your products better.

    LEAVE A REPLY

    Please enter your comment!
    Please enter your name here

    Related News

    Must Read

    EDOM Seminar Explores the Next Generation of Physical AI Robots Powered by NVIDIA Jetson Thor

    The wave of innovation driven by generative AI is...

    Nuvoton Releases Compact High-Power Violet Laser Diode (402nm, 1.7W)

    Nuvoton Technology announced today the launch of its compact...

    Enhancing Embedded Systems with Automation using CI/CD and Circuit Isolation Techniques

    Courtesy: Lokesh Kumar, Staff Engineer, STMicroelectronics and Raunaque Mujeeb...

    Cabinet approves Rare Earth Permanent Magnet Manufacturing Scheme, worth Rs. 7,280 crores

    The Cabinet approved the Rs. 7,280 crore Rare Earth...

    Decoding the Future of Electronics with TI India

    In an exclusive conversation with Kumar Harshit, Technology Correspondent,...

    ECMS applications make history, cross Rs. 1 lakh crore in investment applications

    Union Minister for Electronics and IT Ashwini Vaishnaw announced...

    AI-Driven 6G: Smarter Design, Faster Validation

    Courtesy: Keysight Technologies Key takeaways: Telecom companies are hoping...

    Scaling up the Smart Manufacturing Mountain

    Courtesy: Rockwell Automation A step-by-step roadmap to adopting smart manufacturing...