HomeNewsIndia NewsNew Grade of Seco End Mills Boosts Tool Life for Difficult Materials

New Grade of Seco End Mills Boosts Tool Life for Difficult Materials

New Jabro-Solid2 JS750 end mills from Seco boost tool life by 25 percent to 40 percent compared to previous tool technology. As counterparts to the company’s industry-leading JS500 series, the new JS754 and JS755 tools provide cost-effective high performance designed specifically for processing challenging materials typically found in the aerospace sector, including ISO M (stainless steel) and S (heat-resistant super alloys and titanium).

Within the new series, the versatility of the various JS754 and JS755 cutter geometries optimizes conventional side milling, roughing and slotting, as well as advanced roughing and dynamic milling operations. The cutters’ smooth peripheral rake faces and strong radius design efficiently evacuate chips while keeping a true radius form. Increased front back tapers enhance speed and reliability when interpolating or ramping for pocket machining.

The broad range of JS754 and JS755 tool variations and features ensures the highest cutting performance. With this new series of end mills, shops can match tool to application with various lengths, OD neck reduction sizes and corner radii, as well as chip splitters and through-coolant options.

Range overview:

• JS754: 4-flute side roughing, side finishing and slotting, APMXS=2*DC + OD
– ø3-25 chamfer and radii offer RE0.2 0.5 1.0 1.5 2.0 3.0 4.0 6.0, normal length
– ø6-20 chamfer ICC through coolant, normal length
– ø10 and ø12 chamfer including chip splitters, normal length

• JS754: 4-flute side roughing, side finishing, APMXS=3.5 – 4*DC + OD
– ø6-25 chamfer and radii offer RE0.2 0.5 1.0 2.0 3.0 4.0 6.0, long length
– ø10-20 chamfer including chip splitters, long length (advanced roughing)

• JS755: 5-flute high volume side rough and side finishing, APMXS=2*DC + OD
– ø6-25 chamfer and radii offer RE0.5 1.0 2.0 3.0 6.0, normal length

• JS755: 5-flute high volume side roughing, side finishing, APMXS=3.5 – 4*DC + OD
– ø6-25 chamfer and radii offer RE0.2 0.5 1.0 2.0 3.0 4.0 6.0, long length
– ø10-20 chamfer including chip splitters, long length (advanced roughing)

ELE Times Research Desk
ELE Times Research Deskhttps://www.eletimes.ai
ELE Times provides a comprehensive global coverage of Electronics, Technology and the Market. In addition to providing in depth articles, ELE Times attracts the industry’s largest, qualified and highly engaged audiences, who appreciate our timely, relevant content and popular formats. ELE Times helps you build awareness, drive traffic, communicate your offerings to right audience, generate leads and sell your products better.

Related News

Must Read

Interview | Manish Dave, Head of Industrials – India, Henkel Adhesive Technologies

Henkel Adhesive Technologies, the market leader in adhesives, sealants...

ASMPT Presents New SOLO Placement Head for AI Server Applications

With its new SOLO placement head, ASMPT SMT Solutions,...

CyteSi and QIAGEN Advance Automated NGS Library Preparation on the Turing Biosystem D1

CyteSi, a Menlo Park–based innovator in digital microfluidics, today...

Synaptics Coralboard Edge AI Development Board, Now Available Exclusively From DigiKey

DigiKey, the global distribution leader of electronic components and...

AVL and VisIC Advance GaN-Based EV Inverters to Improve EV Powertrain Efficiency

​AVL and VisIC Technologies are partnering companies that share...

New ZVS Inverter Technology Cuts EV Motor Voltage Overshoot by Over 90%

Hillcrest Energy Technologies, a Canadian clean technology company specializing...

Researchers Develop Solid-State Lithium-Sulfur Battery Design for Faster Charging and Longer Life

​With the rising demands of electric vehicles, researchers are...

Lockheed Martin Introduces PAC-3 Edge Interceptor for Advanced Missile Threats

Lockheed Martin has announced a new and improved missile...