HomeNewsIndia NewsNew horizontal mount chassis facilitates multiple backplane architectures

New horizontal mount chassis facilitates multiple backplane architectures

Pixus Technologies, a provider of embedded computing and enclosure solutions, now offers a highly versatile 5.25” tall chassis that accepts 3U or 6U boards mounted horizontally of various backplane types.

With Pixus’ modular design that accepts various card guide and rail options, one can incorporate OpenVPX, cPCI Serial, VME64x or other Eurocard architectures in the new horizontal mount chassis.  The chassis typically accepts up to six 6U modules at a 0.8” pitch or five 6U modules at 1.0” pitch.   A divider can be placed to split the opening to accept dual rows of 3U modules or a mix of 3U and 6U boards.

The chassis supports multiple pluggable (or fixed) power supplies in various voltage/wattage options. Side-to-side cooling is standard, but front-to-rear versions are available upon request.

Pixus offers OpenVPX backplanes, chassis platforms, and specialty products.  The company also provides enclosure solutions in MicroTCA, cPCI Serial, AdvancedTCA, as well as instrumentation case formats.

For more information, visit: www.pixustechnologies.com 

ELE Times Research Desk
ELE Times Research Deskhttps://www.eletimes.ai
ELE Times provides a comprehensive global coverage of Electronics, Technology and the Market. In addition to providing in depth articles, ELE Times attracts the industry’s largest, qualified and highly engaged audiences, who appreciate our timely, relevant content and popular formats. ELE Times helps you build awareness, drive traffic, communicate your offerings to right audience, generate leads and sell your products better.

Related News

Must Read

Renesas Expands GaN Portfolio with First Low-Voltage GaN FETs for AI Data Centers and Robotics

Renesas Electronics Corporation, a premier supplier of advanced semiconductor...

Top 10 AI Agent Platforms for Enterprises

How leading enterprise AI platforms are helping organisations build,...

Keysight and Research Institutions Simplify Testing of Next- Generation Semiconductor Devices

Keysight Technologies has collaborated with the University of Glasgow,...

What Is Agentic AI ? Architecture, Components, Workflows, and Enterprise Use Cases

​AI is leaving the question-answering and content-generation stage. The...

Nuvoton Introduces 26-Cell EIS Battery Monitoring IC for EV Battery Diagnostics

Nuvoton Technology will begin providing samples of the KA85010UA,...

Murata Begins Mass Production of World’s Smallest 0201-Inch Three-Terminal Low-ESL MLCCs

Murata Manufacturing, a Japanese global leader in electronic components...

GM and LG Develop Lithium Manganese-Rich Batteries to Lower EV Costs, Increase Energy Density

​According to General Motors’ official newsroom, General Motors (GM)...