HomeNewsIndia NewsAshwini Vaishnaw meets Japanese Minister to collaborate on latest tech

    Ashwini Vaishnaw meets Japanese Minister to collaborate on latest tech

    Union Minister for Electronics and Information Technology, Ashwini Vaishnaw, met the Digital Minister of Japan Kono Taro to discuss on collaborating new technologies, India’s digital public infrastructure, and the country’s telecom stack.

    Vaishnaw shared the information, “Met the Digital Minister of Japan, konotaromp, and discussed cooperating in emerging technologies and India’s digital public infrastructure and India telecom stack. ”

    The meeting of Ashwini Vaishnaw with Japanese digital minister was held only a few days before the India visit of Prime Minister of Japan, Kishida Fumio.

    Notably, following the top-level ministerial visits from ally nations, New Delhi is ready to welcome another important ally, Japan for a high-level bilateral visit.

    The Ministry of External Affairs, in an official statement, informed the schedule of Japanese Prime Minister Kishida Fumio’s visit to India from March 20 to 21.

    During the visit, Fumio will hold talks with Prime Minister Narendra Modi to discuss bilateral and regional issues of mutual interest. They will also discuss their priorities for their respective Presidencies of the G7 and G20. India is currently the chair of the Group of 20 economies for 2023.

    ELE Times Bureau
    ELE Times Bureauhttps://www.eletimes.ai/
    ELE Times provides a comprehensive global coverage of Electronics, Technology and the Market. In addition to providing in depth articles, ELE Times attracts the industry’s largest, qualified and highly engaged audiences, who appreciate our timely, relevant content and popular formats. ELE Times helps you build awareness, drive traffic, communicate your offerings to right audience, generate leads and sell your products better.

    Related News

    Must Read

    Cadence to deliver pre-validated chiplet solutions to Accelerate Chiplet Time to Market

    Cadence announced a Chiplet Spec-to-Packaged Parts ecosystem to reduce...

    Microchip Releases Custom Firmware For NVIDIA DGX Spark For Its MEC1723 Embedded Controllers

    Microchip Technology announced the release of custom-designed firmware for...

    Infineon and HL Klemove collaborate to advance innovation for SDVs

    Infineon Technologies AG and HL Klemove aim to strengthen...

    Fluentgrid Completes Wirepas Certified HES Integration, Joining The Growing Ecosystem For Smart Electricity Metering

    Fluentgrid Ltd., a leading provider of utility digitalisation platforms...

    Cadence Reinforces Long-Term R&D Commitment, Celebrating 20 years in Pune

    Cadence, a global leader in electronic system design, celebrated...

    Redefining Edge Computing: How the STM32V8 18nm Node Outperforms Legacy 40nm MCUs

    STMicroelectronics held a virtual media briefing, hosted by Patrick...