ELE Times Bureau

5598 POSTS
ELE Times provides a comprehensive global coverage of Electronics, Technology and the Market. In addition to providing in depth articles, ELE Times attracts the industry’s largest, qualified and highly engaged audiences, who appreciate our timely, relevant content and popular formats. ELE Times helps you build awareness, drive traffic, communicate your offerings to right audience, generate leads and sell your products better.

MacDermid Alpha Electronics Solutions expands its world-renowned Argomax® sintering technologies

MacDermid Alpha has expanded the Argomax technology offering. Argomax 2148 is a new silver sintering product, designed for electric vehicle power inverters. The sintered...

Microchip’s EV81X90A PIC32CM Curiosity Pro Development Board Based on the Arm Cortex-M0+ with AUTOSAR Support

Mouser Electronics is now stocking the EV81X90A PIC32CM Curiosity Pro development board from Microchip Technology. The EV81X90A development board is well suited for a...

New eBook from Apex Microtechnology and Mouser Offers Expert Perspectives on High Reliability Designs

Mouser Electronics announces a new eBook in collaboration with Apex Microtechnology, exploring the challenges and nuances involved in designing high reliability components. In An...

World Battery & Energy Storage Industry Expo 2023

China Produced 324GWh of Lithium Batteries in 2021, up by 106% Latest date show that in 2021, China’s lithium battery production hit 324GWh (up 106%),...

Mouser Electronics Awarded Global High Service Distributor of the Year by TE Connectivity

Mouser Electronics announced that it has received the Global High Service Distributor of the Year Award for the ninth time from TE Connectivity (TE),...

Compound semiconductor substrate market set to double: how are companies competing in this space?

By Poshun Chiu (Technology & Market Senior Analyst, Yole Intelligence), Ali Jaffal (PhD., Technology & Market Analyst, Yole Intelligence) and Ezgi Dogmus (PhD. Team Lead Analyst,...

Teledyne FLIR Adds New Boson+ Thermal Resolution Options, Radiometry, and MIPI Interface Simplifying Embedded System Integration

Industry-leading 20-mK-sensitivity Boson+ with 640x512 and 320x256 resolutions is ideal for unmanned platforms, security applications, handhelds, wearables, and thermal sights Teledyne FLIR announced the expansion...

STMicroelectronics expands STM32 family with STM32C0 MCUs, ‘STM32MP13 lines’ and STM32WBA, wireless MCU series

STMicroelectronics create semiconductor technologies for a smarter, greener, and more sustainable future. ST is a global Integrated Device Manufacturer. The focus of ST’s innovation...

Some considerations to amplify the battery performance for being a step ahead in the market

Achieving maximum battery performance is an important goal for commercial applications, as it can significantly reduce costs and improve efficiency. In this article, we...

iWave’s most anticipated 64-bit Arm-A55 and RISC-V MPU-based System on Module is launched at EW23

iWave Systems announced an upcoming iW-RainboW-G53M: RZ/G2UL, RZ/A3UL, RZ/Five based System on Module (SOM) built on OSM v1.1 Size-M specification at the Embedded World...

Related News