Evercam’s New 4D View, Powered by iTwin
Evercam is pleased to announce the addition of Evercam 4D View to Bentley Systems’ powered by iTwin program. Evercam 4D View helps project teams...
Renesas and Fixstars to Jointly Develop Tools Suite that Optimizes AD and ADAS AI Software for R-Car SoCs
Renesas Electronics Corporation, a premier supplier of advanced semiconductor solutions, and Fixstars Corporation, a global leader in multi-core CPU/GPU/FPGA acceleration technology, today announced the...
Jidoka Technologies Launches Kompass 3.0, the Next-Gen Visual Inspection Solution for the Manufacturing Sector
Jidoka Technologies, among the pioneers in the field of automated cognitive inspection for manufacturing, has recently launched Kompass 3.0, a next-gen AI-enabled visual inspection...
New Grid-Eye 90° from Panasonic Brings the Right Angle to Machine Learning Based IR Sensing
Panasonic Industry has launched a new member of its popular Grid-Eye sensor family featuring a 90° lens delivering a wider field of view (FoV)...
Rohde & Schwarz and Broadcom Collaborate on Wi-Fi 7 Test Solution for Next Generation Wireless Devices
Rohde & Schwarz and Broadcom Inc. announce the availability of an automated test solution for Broadcom Wi-Fi 7 chipsets, the industry’s first Wi-Fi 7...
Fairview Microwave Releases New Field-Replaceable Connectors
Fairview Microwave, an Infinite Electronics brand and a leading provider of RF, microwave, and millimeter-wave products, has introduced a new series of field-replaceable connectors...
Infineon Adds PQFN Dual-Side Cooling 25-150 V Portfolio to its OptiMOS Source-Down Power MOSFET Family
The design of future power electronic systems is continuously pushed to improve state-of-the-art performance and power density. Supporting this trend, Infineon Technologies AG launches...
Antenova introduces three high efficiency antennas for small Wi-Fi6 and Wi-Fi6E devices
Antenova Ltd, the UK-based manufacturer of antennas and RF antenna modules for IoT and M2M, is announcing three antennas for Wi-Fi6 and Wi-fi6E. They...
Mechnano Releases Tough ESD: Tough Electrostatic Dissipative Photopolymer Resin
Mechnano has developed another Additive Manufacturing (AM) resin based on its breakthrough MechT technology that utilizes the power of discrete Carbon Nanotubes (dCNTs). The...
IBM, Casa Systems & Enea Partner to Deliver Private 5G, RAN Solutions to CSPs
5G technology, when combined with edge computing, artificial intelligence, and blockchain, enables network customization like never before, providing a unique opportunity to build and...
