ELE Times Report

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Advanced Packaging Inspection at SEMICON Taiwan 2023

Test Research, Inc. (TRI), the leading test and inspection systems provider for the electronics manufacturing industry, will join SEMICON Taiwan held at Taipei...

Applied Materials Announces Engagement with Industry Stakeholders for Its Planned Collaborative Center in India

Planned center to bring together global and domestic suppliers and academic institutions to accelerate the development and commercialization of technology for semiconductor manufacturing equipment,...

SEMI Announces Intent to Host SEMICON India in Partnership with India Semiconductor Mission (ISM), India

India Semiconductor Mission (ISM) Provides Key Endorsement of Event SEMI announced its intent to support the India Semiconductor Mission (ISM) in creating a vibrant semiconductor...

Industrial IoT Gateways for Enterprise, Industry 4.0, and Energy Monitoring

In today's rapidly evolving industrial landscape, the convergence of physical machinery and digital technologies has given rise to the Industrial Internet of Things (IIoT)....

SEMICON Taiwan 2023 to Highlight Auto Chips, Advanced Manufacturing, Sustainability, Cybersecurity, Talent

With Taiwan forecast to remain a top buyer of chipmaking equipment, the stage is set for SEMICON Taiwan 2023 as companies from across the...

ELCINA and SEMI Showcase India’s Semiconductor Manufacturing Capability at SemiconIndia 2023 Exhibition

Electronic Industries Association of India (ELCINA) and SEMI, the global industry association that unites the entire electronics manufacturing and design supply chain, are jointly...

Infineon uses recyclable PCBs from Jiva Materials to minimize electronic waste and carbon footprint of demo and evaluation boards

With the growing amount of electronic waste generated by consumers, industry and other sectors, it is critical to address this specific environmental issue. Reducing...

Develop Designs Suitable for Outdoor use with New ip67 TNC Jacks

Amphenol RF expands its TNC product portfolio with new sealed rear mount bulkhead configurations designed for popular low loss cable types. Amphenol RF is pleased...

Infineon presents highly integrated XENSIV 60 GHz radar sensor for consumer electronics, IoT applications, and healthcare devices

Infineon Technologies AG introduces the new XENSIV 60 GHz radar sensor BGT60UTR11AIP. With a compact size of only 16 mm², it is the smallest...

Bringing the in-vehicle sound experience to the next level – Asahi Kasei Microdevices launches sales of AK7709VQ multicore DSP for automotive applications

Asahi Kasei Microdevices (AKM) has launched the AK7709VQ, a new multicore digital signal processor (DSP) conceived for next-generation in-vehicle sound design. This powerful DSP...

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