Anritsu and the University of Texas at Dallas Collaborate to Showcase Orchestration System for OpenROADM/IPoDWDM at OFC 2024
Anritsu Corporation in collaboration with the University of Texas at Dallas showcased its orchestration system for overall control and monitoring of combined OpenROADM and IPoDWDM networks...
STSPIN32G4, The 1st motor controller with an integrated MCU solves 2 major challenges
Author: STMicroelectronics
The STSPIN32G4 integrates a three-phase gate driver, an STM32G431, and a power management system under one package to solve major engineering challenges, thus enabling new applications. While...
Anritsu and NTT Collaborate to Showcase End-to-End 400G Testing for IOWN Open APN at OFC2024
Anritsu Corporation, in collaboration with NTT, will participate in the "OFCnet" state-of-the-art network demonstration environment at the Optical Fiber Communication Conference and Exhibition 2024...
Renesas Introduces Industry’s First General-Purpose 32-bit RISC-V MCUs with Internally Developed CPU Core
RISC-V MCUs Offer Developers a New Low-Power, High-Performance Option Along with Full Toolchain Support
Renesas Electronics Corporation, a premier supplier of advanced semiconductor solutions, today...
Accelerating the Adoption of AI Applications, Nuvoton Technology Introduces an Endpoint AI Product Platform Based on Microcontrollers and Microprocessors
Nuvoton Technology introduces an endpoint AI platform based on microcontrollers, expanding the AI ecosystem into the microcontroller domain. This solution is based on Nuvoton's...
Microchip Technology Expands TrustFLEX Family with CEC1736 Real-time Platform Root of Trust Devices
TrustFLEX devices along with the Trust Platform Design Suite tool will simplify the enablement of the root of trust from concept to production in...
Vertiv Joins the NVIDIA Partner Network
Vertiv brings its high-density power and cooling infrastructure expertise to the NVIDIA Partner Network to better support adoption of accelerated computing and AI workloads
Vertiv,...
New SSO10T TSC top-side cooling package for power MOSFETs enables highest efficiency for modern automotive applications
Infineon Technologies AG introduces the SSO10T TSC package with OptiMOS MOSFET technology. With its direct top-side cooling concept, the package offers excellent thermal performance....
Infineon extends its XDP digital power protection controller family with the XDP700-002, the industry’s first wide input voltage hot-swap controller for telecom infrastructure
Infineon Technologies AG is expanding its XDP digital power protection controller product family with the XDP700-002, the industry's first -48 V wide input voltage...
Infineon presents innovative semiconductor and microcontroller solutions for a greener future at embedded world 2024
Decarbonization and digitalization are the two central challenges of our time, but they rely on new and advanced technologies. At embedded world 2024 in...
