Room to Grow: Seamless Expansion of Networks at the Edge
As industries evolve for increased resilience, their network infrastructures also grow more complex. Configuration, maintenance, and troubleshooting of such networks can be daunting. For...
The Impact of Channel Hole Profiles on Advanced 3D NAND Structures
In a two-tier 3D NAND structure, the upper and lower channel hole profile can be different, and this combination of different profiles leads to...
IIoT Potential with Edge Computing
By: Mouser Electronics
Computing on the Edge of the IIoT with TE Connectivity Product Solutions
As the Industrial Internet of Things (IIoT) continues to evolve and...
Towards an AI-native air interface for 6G: Rohde & Schwarz and NVIDIA showcase AI/ML-based neural receiver with custom modulation at Brooklyn 6G Summit
With research on the technology components for the future 6G wireless communication standard in full swing, the possibilities of an AI-native air interface for...
Infineon AIROC CYW5551x combines Wi-Fi 6/6E performance surpassing standards and advanced Bluetooth connectivity for IoT applications
Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) today announced the company is extending its AIROC portfolio with the AIROC CYW5551x Wi-Fi 6/6E and...
STMicroelectronics Reports 2023 Third Quarter Financial Results
STMicroelectronics Reports 2023 Third Quarter Financial Results
Q3 net revenues $4.43 billion; gross margin 47.6%; operating margin 28.0%; net income $1.09 billion
YTD net...
STMicroelectronics’ dual-inline silicon-carbide power modules offer versatile package configurations for automotive applications
STMicroelectronics has released the ACEPACK 1DMT-32 family of silicon carbide (SiC) power modules in a convenient 32-pin, dual-inline, molded, through-hole package for automotive applications. Targeted at systems...
IoT devices: Is it time to consider GSMA eSIMs?
Author: STMicroelectronics
The summer brought some exciting news for IoT developers. The integration of eSIM cards into IoT devices can now be streamlined with GSMA’s...
Hyundai Motor Company, Kia Corporation and Infineon sign multi-year supply agreement for power semiconductors
Infineon Technologies and Hyundai Motor Company and Kia Corporation have signed a multi-year supply agreement for silicon carbide (SiC) and silicon (Si) power semiconductors....
CEA-Leti Launches R&D Program to Improve ‘Cooperation’ Between Autonomous Vehicles Via V2X Communication
R&D Vision Includes Adapting Wireless Technology for Drones and Robots in Factories
CEA-Leti today announced a new R&D initiative to contribute to a higher level...
