HomeNewsIndia NewsAWS, Microchip together to create a more secure connection to the cloud

AWS, Microchip together to create a more secure connection to the cloud

The rise of the Internet of Things (IoT) has created a new set of security considerations for the cloud. Now not only do you need to safeguard the data inside an IoT gateway or node, but you must also ensure the device can securely communicate with cloud servers – and this has become one of the next big challenges for design engineers.

One of the most prominent players in the cloud space, Amazon Web Services (AWS), tackled this challenge early by adopting a mutual authentication security model. In order to comply, an IoT device manufacturer must pre-register their security authority to establish a trust model and create a unique cryptographic key for each device that is signed by the security authority. Most importantly, these keys must remain secret for the entire lifecycle of the device. This process is essential for ensuring a high level of security, but it can add some cost and complexity for device manufacturers, requiring secure databases and cryptographic knowledge.

Back in August, Microchip announced the AWS-ECC508, an IC solution designed to meet the requirements for securely connecting to AWS IoT. The device is a small chip that is pre-loaded with the unique cryptographic codes to allow data to be transmitted more securely from an IoT device to the cloud. The chip can be soldered onto any board and connected over I2C to any microcontroller and, having been developed with input from AWS, meets all the requirements of the AWS mutual authentication security model and is pre-programmed to use AWS’s Just-in-Time registration, which allows devices to automatically connect to and be recognized by the AWS IoT cloud the first time they request service from the platform. It also has an array of features, including tamper-resistant technology, that help enhance security.

A kit is available for the evaluation and engineering phase, the standard AWS-ECC508 device will serve engineers during the prototyping and pre-production phases, and, finally, customized devices will be created for production.

ELE Times Bureau
ELE Times Bureauhttps://www.eletimes.ai/
ELE Times provides a comprehensive global coverage of Electronics, Technology and the Market. In addition to providing in depth articles, ELE Times attracts the industry’s largest, qualified and highly engaged audiences, who appreciate our timely, relevant content and popular formats. ELE Times helps you build awareness, drive traffic, communicate your offerings to right audience, generate leads and sell your products better.

Related News

Must Read

Murata Introduces World’s First 2.2μF/100Vdc Soft-Termination Chip MLCC in 0805-inch Size for Automotive Applications

Murata Manufacturing Co., Ltd. introduces the GCJ21BD72A225KE02, a soft-termination...

Qorvo Eliminates Negative Bias in New RF Control Portfolio

Qorvo, a leading global provider of connectivity and power...

Rohde & Schwarz Secures Critical Certification for Next-Gen eCall Compliance

Rohde & Schwarz successfully certifies the testing of its...

XpressConnect PCIe 6.0: Solving AI Data Center Latency

Strengthening Microchip Technology’s data center solutions portfolio, the retimers...

BTL Deploys Taiwan’s First CTIA-Compliant OTA Test System with Rohde & Schwarz

Rohde & Schwarz supplies the independent test house BTL Laboratory in...

Optimizing Vision: High-Performance Testing for Industrial Cameras and Displays

Video Dragon 6222 combines a frame grabber and frame...

Infineon Brings 800V Power Delivery to Nvidia’s MGX AI Server Racks

Infineon Technologies, a leading provider of power systems and...

Keysight Tackles Semiconductor Talent Gap with Executable RF Design Whiteboard

Keysight Technologies, Inc. announces a new capability within its...

MacDermid Alpha Tackles Power Module Reliability

MacDermid Alpha Electronics displays its latest attachment materials, which...