HomeNewsIndia NewsBluetooth 4.2 Host Controller Interface Module with Integrated Chip Antenna by Telit

    Bluetooth 4.2 Host Controller Interface Module with Integrated Chip Antenna by Telit

    Telit, a global enabler of the Internet of Things (IoT), on September 6,  announced the BL871E2-HI, a dual-mode Bluetooth 4.2 host controller interface module with embedded chip antenna and audio support. The ultra-compact component is optimized for efficiency and simplicity in end-device design, delivering reliable Bluetooth functionalities with robust endpoint security, leveraging the processing power and external Bluetooth stack of the host application processor.  The module includes certifications, all hardware features that reduce development costs, bill of materials, and time to market.

    Ideal for quick-turn projects, the BL871E2-HI seamlessly speeds up device design across a wide range of industrial and consumer applications areas. The 9.7×10.1mm, 18-pad LCC component delivers basic rate (BR), enhanced data rate (EDR) and low-energy (LE) connectivity, for applications such as scanners & printers, mobile point of sales, m-healthcare, industrial gateways, and for audio equipped devices across all areas of the electronics industry.

    The BL871E2-HI is SRCC (Radio Transmission Equipment Type Approval – China), RED (Radio Equipment Directive Compliance – Europe) and FCC (Federal Communication Commission Type Approval – USA) certified; and is qualified and listed as a Bluetooth 4.2 controller subsystem. It integrates the company’s portfolio of Bluetooth modules, directly addressing the demand from the rapidly growing BT/BLE-IoT market.

    “We are seeing a significant increase in the number of device manufacturers across a broad set of industries looking to update and refresh their products with Bluetooth connectivity,” explained Sandro Spanghero, Telit Senior VP of Global Product Management. “With the BL871E2, we are responding to this demand rise. The new product is ideal in these cases because it is an accomplished, very small and low-cost RF frond-end module that connects to the processor already designed into the host device, delivering full-featured Bluetooth connectivity for up to seven active concurrent connections.”

    The BL871E2-HI is a hardware-only product. It requires no additional external supporting components to deliver Bluetooth functionality to the host device. The required Bluetooth stack is not included with the module to maximize bill-of-material flexibility. Either a customer-provided or Telit-sourced Blue Code +SR protocol stack must be made to run in the host processing environment to complete the solution.

    In addition to efficient performance and low power consumption, BL871E2-HI includes value-added features that further streamline development: Supports Android, Linux and Windows Bluetooth stacks

    • Class 1 TX power up to +12 dBm
    • Receiver Sensitivity: -95 dBm
    • UART, PCM and I²S interfaces
    • BR/EDR 128-bit hardware encryption accelerator
    • Scatternet: Up to 3 simultaneous piconets – 1 master and 2 slaves
    • Fast Automatic Frequency Hopping (AFH) algorithm
    • Support for all voice air-coding schemes
    • Assisted mode for HFP 1.6 Wideband Speech (WBS)

    Integrators and manufacturers designing with the BL871E2-HI have access to comprehensive development and integration tools including a Raspberry PI 2-based evaluation and development kit with extensive software and support resources.

    For more information visit http://www.telit.com/sr-rf/.

    ELE Times Bureau
    ELE Times Bureauhttps://www.eletimes.ai/
    ELE Times provides a comprehensive global coverage of Electronics, Technology and the Market. In addition to providing in depth articles, ELE Times attracts the industry’s largest, qualified and highly engaged audiences, who appreciate our timely, relevant content and popular formats. ELE Times helps you build awareness, drive traffic, communicate your offerings to right audience, generate leads and sell your products better.

    Related News

    Must Read

    Keysight to Demonstrate NR-NTN devices Mobility Testing at MWC 2026 in Collaboration with Samsung

    Keysight Technologies, Inc. will demonstrate lab-based validation of new...

    ROHM Strengthens Supply Capability for GaN Power Devices

    Combining TSMC’s Process Technology to Build an End-to-End, In-Group...

    element14 Community launches smart security and surveillance design challenge

    element14, an Avnet Community, in collaboration with ADI, has...

    R & S and LITEON demonstrate high‑throughput 5G femtocell testing with the PVT360A

    Rohde & Schwarz and LITEON collaborate to showcase a...

    Infineon presents MCU and sensor solutions for the future of AI, IoT, mobility, and robotics

    Next-generation embedded systems are essential for applications in the...

    R&S advances AI-RAN testing using digital twins in collaboration with NVIDIA

    Rohde & Schwarz will showcase a new milestone in...

    Top Seven Tech Trends in the semiconductor sector for 2026

    By: STMicroelectronics In 2026, a new class of intelligent machines...