HomeElectronicsTest and MeasurementBosch selects Rohde & Schwarz to Verify Automotive UWB Connectivity

    Bosch selects Rohde & Schwarz to Verify Automotive UWB Connectivity

    Because of its excellent ranging, power consumption and security capabilities, ultra-wideband (UWB) is likely to feature on a wide range of IoT peripherals and industry 4.0 applications in the future and is expected to be a standard technology of most smartphones. In the automotive domain, UWB enables new convenience and functional safety use cases specifically for keyless vehicle access using the smartphone as a digital key. Further advanced features could be valet parking, occupancy detection and even life sign monitoring of babies in the child seat.

    UWB, based on the IEEE 802.15.4a and 802.15.4z standards, enables centimetre-accurate location measurements at short distances, most effectively up to 70 meters. The technology includes secure data communication at rates up to 27 Mbps, with very low power requirements. The very wide bandwidth of 500 MHz and more, combined with the very low power spectrum density make it possible for UWB signals to share spectrum with other technologies without causing interference.

    Testing the performance of UWB devices is important in the lab and on the production line to ensure regulatory aspects, correct functioning and the accuracy of the positioning application. As a leader in wireless device testing, Rohde & Schwarz provides a full range of UWB test solutions for R&D, certification, chipset characterisation and production that accurately measure key parameters such as Time of Flight (ToF) and Angle of Arrival (AoA). Furthermore, Rohde & Schwarz supports global cross-industry standards for UWB interoperability by joining the FiRa and Car Connectivity Consortium.

    Rohde & Schwarz integrated UWB test capabilities into their R&S CMP200 radio communication tester, making it the only test platform on the market able to provide R&D and production RF tests for both 5G mmWave / FR2 and UWB functions. It is ideal for solving UWB test challenges in mass production as well as in R&D. The tester combines the capabilities of a signal analyzer and a signal generator in a single instrument. In combination with Rohde & Schwarz shielded chambers and the company’s automatization software WMT, the R&S CMP200 offers a complete solution for transmitter, receiver, ToF and AoA measurements in conducted and radiated mode, compliant to IEEE 802.15.4a/z specifications.

    “We’re pleased to support Bosch, the leading global supplier of technology in automotive electronics, with our wireless connectivity test solutions. Our R&S CMP200 radio communication tester together with our OTA test chambers are the right choice providing the test coverage and reliability required by the automotive industry. The system can also be used to test 5G connectivity,” said Juergen Meyer, Vice President Automotive at Rohde & Schwarz.

    Markus Hetzel, Manufacturing Engineer at Bosch, said: “This joint cooperation fosters industrywide standards like UWB for communications between vehicles and smartphones. Testing the performance of UWB devices is important in the lab and on the production line to ensure compatibility and correct operation.”

    For more information about UWB technology and Rohde & Schwarz test solutions, visit www.rohde-schwarz.com

    ELE Times News
    ELE Times Newshttps://www.eletimes.ai/
    ELE Times provides extensive global coverage of Electronics, Technology, and the Market. In addition to providing in-depth articles, ELE Times attracts the industry’s largest, qualified, and highly engaged audiences, who appreciate our timely, relevant content and popular formats. ELE Times helps you build experience, drive traffic, communicate your contributions to the right audience, generate leads, and market your products favorably.

    Related News

    Must Read

    Qualitas Semiconductor Picks Anritsu’s Vector Network Analyzer for High-Speed Interconnect Signal Integrity Verification

    Qualitas Semiconductor Co., Ltd., a leading developer specialising in...

    The Tomorrow for AI and India’s edge advantage

    Courtesy: Qualcomm Artificial intelligence is entering its next chapter, one...

    Posifa Technologies Introduces PVC4001-C MEMS Pirani Vacuum Transducer for Wide-Range Vacuum Measurement

    Posifa Technologies has introduced its new PVC4001-C MEMS Pirani vacuum...

    STMicroelectronics to support AI infrastructure demand with high-volume production of its industry-leading silicon photonics platform

    STMicroelectronics is now entering high-volume production for its state-of-the-art...

    Impact of AI on Computing and the Criticality of Testing

    Courtesy: Teradyne Artificial intelligence (AI) is transforming industries, enhancing our...

    Disruptions from Wide Bandgap Continue Turbulence

    Courtesy: Avnet When we experience major shifts in the technology...

    Securing Humanoid Robotics with TPM-Anchored FPGAs

    Courtesy: Lattice Semiconductor The humanoid robotics market is rapidly transitioning...

    Keysight Expands Digital‑Layer Error Performance Validation for High‑Speed 1.6T Interconnects in AI Data Centres

    Keysight Technologies, Inc. introduced the Functional Interconnect Test Solutions (FITS) portfolio...

    CEA-Leti and NcodiN Collaborate on 300 mm Silicon Photonics for Bandwidth-Consuming AI Interconnects

    CEA-Leti and NcodiN, a French deep-tech startup pioneering nanolaser-enabled...