HomeIndustryAerospace and DefenceAdvanced EW systems can benefit from consolidating workloads on a single machine...

    Advanced EW systems can benefit from consolidating workloads on a single machine ?

    Leveraging data center performance benefits

    Bringing data center performance benefits to EW applications, the Xeon processor D delivers 10 times greater performance than currently available in other ruggedized HPEC platforms. Using the eight-core version of the processor D, computing blades are able to support heavier throughput by delivering as much as 3.4 times faster performance per node and up to 1.7 times the better performance per watt when compared to the Intel Atom processor C2750.

    Intel’s latest processors include support for error-correcting code memory, combined with enhanced hardware-based Intel VT and Intel Advanced Encryption (AES-NI). This advanced integration is inherently SWaP-C optimized, and offers long-life availability and enhanced silicon reliability through Intel’s 10-year simulation aging tests, making it an optimal engine for HPEC platforms.

    ELE Times Bureau
    ELE Times Bureauhttps://www.eletimes.ai/
    ELE Times provides a comprehensive global coverage of Electronics, Technology and the Market. In addition to providing in depth articles, ELE Times attracts the industry’s largest, qualified and highly engaged audiences, who appreciate our timely, relevant content and popular formats. ELE Times helps you build awareness, drive traffic, communicate your offerings to right audience, generate leads and sell your products better.

    Related News

    Must Read

    Impact of AI on Computing and the Criticality of Testing

    Courtesy: Teradyne Artificial intelligence (AI) is transforming industries, enhancing our...

    Disruptions from Wide Bandgap Continue Turbulence

    Courtesy: Avnet When we experience major shifts in the technology...

    Securing Humanoid Robotics with TPM-Anchored FPGAs

    Courtesy: Lattice Semiconductor The humanoid robotics market is rapidly transitioning...

    Keysight Expands Digital‑Layer Error Performance Validation for High‑Speed 1.6T Interconnects in AI Data Centres

    Keysight Technologies, Inc. introduced the Functional Interconnect Test Solutions (FITS) portfolio...

    CEA-Leti and NcodiN Collaborate on 300 mm Silicon Photonics for Bandwidth-Consuming AI Interconnects

    CEA-Leti and NcodiN, a French deep-tech startup pioneering nanolaser-enabled...

    How good are ultra-low bitrate speech codecs?

    Courtesy: Rhode and Schwarz Quality Evaluation of Speech Coding Technologies A...

    NXP CoreRide Puts Automakers on Fast Path to 48 V Scalable Zonal Architectures

    NXP Semiconductors introduced its NXP CoreRide Z248 zonal reference...

    Microchip Helps Manufacturers Meet Cybersecurity Regulations, Expands Security Services in the Trust Platform

    As cybersecurity regulations tighten worldwide, product manufacturers must embed...

    Everspin Launches New Generation of Unified Memory for Embedded Systems

    Everspin Technologies, a leading developer and manufacturer of magnetoresistive...