HomeNewsIndia NewsElectrolube Launch Non-Silicone Zinc Oxide Free Thermal Paste

    Electrolube Launch Non-Silicone Zinc Oxide Free Thermal Paste

    Electrolube, the global manufacturer of electro-chemicals, has announced the launch of a new Non-Silicone Heat Transfer Compound, HTCX_ZF. The high-performance thermal management paste is an entirely Zinc Oxide (ZnO) free version of one of the company’s best-selling thermal products, HTCX, with the additional benefits of improved thermal conductivity, lower oil bleed, and lower evaporation weight loss. Designed for use as a thermal interface material, HTCX_ZF is ideal for applications where the use of zinc oxide, a marine pollutant, is restricted and silicones are prohibited, such as offshore utilities for instance. The new RoHS-2 compliant thermal paste is also highly suitable for applications exposed to varying temperature and humidity conditions.

    HTCX_ZF is a highly stable, non-curing paste, which enables simple and efficient rework of components if needed and is recommended where efficient and reliable thermal coupling of electrical and electronic components is required, and between any surface where thermal conductivity and heat dissipation is important. It offers efficient thermal conductivity of 1.65 W/m.K for a range of applications, remaining stable and keeping a low oil bleed percentage through a wide operating temperature range from -50°C to +180°C and potentially higher, depending on the application and testing in relevant end-use conditions.
    HTCX_ZF can be applied to the base and mounting studs of diodes, transistors, thyristors, heat sinks, silicone rectifiers and semi-conductors, thermostats, power resistors and radiators, to name but a few. When the contact surfaces are placed together, a firm metal-to-metal contact will only be achieved on 40 – 60% of the interface, depending on the smoothness of the surfaces. This means that air, which has relatively poor thermal conductivity, will account for the balance of the interface. Only a small amount of HTCX_ZF is required to fill these spaces to dramatically increase the effective surface area for heat transfer. HTCX_ZF is also easy to apply, ensuring the best results are achieved with a uniform, thin coat applied between mating surfaces. For further information, please visit http://www.electrolube.com.

    ELE Times Research Desk
    ELE Times Research Deskhttps://www.eletimes.ai
    ELE Times provides a comprehensive global coverage of Electronics, Technology and the Market. In addition to providing in depth articles, ELE Times attracts the industry’s largest, qualified and highly engaged audiences, who appreciate our timely, relevant content and popular formats. ELE Times helps you build awareness, drive traffic, communicate your offerings to right audience, generate leads and sell your products better.

    LEAVE A REPLY

    Please enter your comment!
    Please enter your name here

    Related News

    Must Read

    Nuvoton Launches Arbel NPCM8mnx System-in-Package (SiP) for AI Servers and Datacenter Infrastructure

    Breakthrough BMC Innovation Powers Secure, Scalable, and Open Compute...

    STMicroelectronics joins FiRa board, strengthening commitment to UWB ecosystem and automotive Digital Key adoption

    STMicroelectronics has announced that Rias Al-Kadi, General Manager of the...

    NEPCON ASIA 2025: Showcasing the Future of Smart Electronics Manufacturing

    NEPCON ASIA 2025, taking place from October 28 to...

    Renesas Expands Sensing Portfolio with 3 Magnet-Free IPS ICs & Web-Based Design Tool

    New Simulation & Optimization Platform Enables Custom Coil Designs...

    IEEE IEDM, 2025 Showcases Latest Technologies in Microelectronics, Themed “100 Years of FETs”

    The IEEE International Electron Devices Meeting (IEDM) is considered...

    OMNIVISION Introduces Next-Generation 8-MP Image Sensor For Exterior Automotive Cameras

    OMNIVISION announced its latest-generation automotive image sensor: the OX08D20, 8-megapixel (MP) CMOS...

    Vishay Intertechnology Expands Inductor Portfolio with 2000+ New SKUs and Increased Capacity

    Vishay Intertechnology, Inc. announced that it has successfully delivered...

    Keysight to Demonstrate AI-enabled 6G and Wireless Technologies at India Mobile Congress 2025

    Keysight Technologies will demonstrate 20 advanced AI-enabled 6G and...

    Ashwini Vaishnaw Approves NaMo Semiconductor Lab at IIT Bhubaneswar

    As part of a big push towards the development...