Semiconductors and Chips

    Industry’s First PCIe 7.0 IP Solution for Next-Gen HPC and AI Chips Designs

    Synopsys recently unveiled the industry's first complete PCIe 7.0 IP solution, designed to accelerate trillion-parameter HPC and AI supercomputing chip designs. This new IP...

    New OptiMOS 7 MOSFETs improve on-state resistance, design robustness and switching efficiency in automotive applications

    Infineon Technologies AG is expanding its portfolio of next-generation OptiMOS 7 MOSFETs for automotive applications: the portfolio of 40 V products now includes additional...

    Nordson Test & Inspection to Showcase Advanced Semiconductor Technologies at SEMICON West 2024

    Nordson TEST & INSPECTION today announced plans to exhibit at SEMICON West 2024, scheduled to take place July 9-11 at the Moscone Center in...

    TI unveils industry’s first GaN IPM to enable smaller energy-efficient high-voltage motors

    “With TI’s new GaN IPM, engineers can design motor driver systems that deliver all these expectations and operate at peak efficiency.” Texas Instruments (TI)  introduced...

    Infineon leads the way in decarbonization with Product Carbon Footprint data for customers

     Infineon takes a pioneering role in the semiconductor industry and creates transparency for its customers regarding the climate impact of individual product families ...

    Geely Auto Gears up NEV Transformation and Innovation with Long-Term SiC Supply Agreement and Joint...

    ST’s third-generation SiC MOSFETs help increase the powertrain efficiency for Geely Auto Group battery electric vehicles. Innovation Joint Lab was set up to...

    AEK-POW-BMS63EN or the critical art of making battery management solutions more accessible

    Author: STMicroelectronics If we had to summarize the spirit that drives the AEK-POW-BMS63EN development board in one word, it would be accessibility. Battery management applications are notoriously challenging,...

    Era of Innovation with Comprehensive Portfolio of Copilot + PCs

    Microsoft has set specific requirements for a PC to be classified as a Copilot+ PC. These include: A Neural Processing Unit with at least...

    Infineon presents new 600 V CoolMOS 8 SJ MOSFET family for advanced and cost-effective power...

    Infineon Technologies AG introduces the 600 V CoolMOS 8 high voltage superjunction (SJ) MOSFET product family. The devices combine the best features of the...

    CGD’s GaN Power IC Packages Deliver Increased Power Output, Simplifying Inspection and Saving Cost

    Cambridge GaN Devices (CGD) has launched two new packages for their ICeGaN family of GaN power ICs. These new packages are designed to enhance...

    India’s Semiconductor Dream: Building Manufacturing Prowess and Global Outreach

    The Indian semiconductor industry is projected to reach USD 55 billion by 2026. To address the global semiconductor shortage, the Indian government has established...

    Infineon announces CoolGaN bidirectional switch and CoolGaN Smart Sense for higher performance and more cost-effective...

    Infineon Technologies AG today announced two new CoolGaN product technologies, CoolGaN bidirectional switch (BDS) and CoolGaN Smart Sense. CoolGaN BDS provides exceptional soft- and...

    STMicroelectronics to build the world’s first fully integrated silicon carbide facility in Italy

    New high-volume 200mm silicon carbide manufacturing facility for power devices and modules, as well as test and packaging, to be built in Catania,...

    Centre is Working to Extend a R&D Wing under Semicon Research Centre

    The government is planning to establish a dedicated research and development (R&D) wing under the proposed India Semiconductor Research Centre (ISRC). This R&D wing...

    Infineon receives building permit for final construction phase of Smart Power Fab in Dresden

    – Saxony's Prime Minister Michael Kretschmer hands over the last outstanding building permit for the construction project – Infineon is on schedule with the Smart Power...

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