Semiconductors and Chips

Automotive

New portfolio of isolation devices from TI extends the lifetime of high-voltage applications to...

ELE Times Report -
Improve signal integrity and reduce power consumption by as much as 80% with pin-to-pin replacement to optocouplers. New opto-emulators improve performance over end-product...
Artificial Intelligence

Spirent collaborates with H3C to complete industry’s first large-scale 800G test

ELE Times Report -
Spirent Communications, the leading provider of test and assurance solutions for next-generation devices and networks, has supported H3C in successfully completing the industry’s first...
Battery and Energy Storage

Nuvoton Releases New Series Automotive Battery Monitoring Chipset

ELE Times Report -
Nuvoton Technology Corporation Japan (NTCJ) today announced the launch of 4th generation of battery monitoring chipset for automotive battery control to measure the voltage...
Press Release

Mouser Electronics Stocking Wide Selection of Connectivity and Location Products from u-blox

ELE Times Report -
Mouser Electronics, Inc., the industry's leading New Product Introduction (NPI) distributor with the widest selection of semiconductors and electronic components, offers an extensive product...
Editor's Choice

Wideband Gap Semiconductors: What Modeling Challenges Must We Overcome

ELE Times Report -
As power electronics shrink in size, the demands on power, frequency, and efficiency grow exponentially. The semiconductor industry is leaning heavily into wide bandgap...
Automation

Auto EV India 2.O: Travel into the Future of Mobility

ELE Times Bureau -
Experience the Disruptive Automotive and EV Technologies Live. Second Edition of Auto EV India 2023 is going to take you to the next level...
Automation

OMRON Automation intensifies focus on “i-BELT” – its Data-Driven “Co-Creation” Solution Service

Saurabh Bhuria -
OMRON Automation, a leading provider of advanced industrial automation solutions in India, is all set to strengthen its business focus around “i-Belt” – the...
Automotive

AEKD-AICAR1: Machine Learning in cars with an ST board to avoid mindless hype and being...

Saurabh Bhuria -
The AEKD-AICAR1 evaluation kit, an AI plugin, and AutoDevKit make up the SL-AIAID012401V1, ST’s first machine learning solution that recognizes four car states: parked, normal road condition, bumpy road, skidding or...
News

Leading Semiconductor Industry Players Join Forces to Accelerate RISC-V

ELE Times Report -
Establishing a new company to drive RISC-V ecosystem and hardware development Semiconductor industry players Robert Bosch GmbH, Infineon Technologies AG, Nordic Semiconductor, NXP® Semiconductors, and...
News

All India Council for Technical Education (AICTE) is collaborating with Arm® Education and STMicroelectronics to...

ELE Times Report -
The Government of India has been focused on developing the country’s semiconductor ecosystem and catalysing India’s rapidly expanding electronics manufacturing industry. These efforts will enable innovation and...
Editor's Choice

Shaping the Semiconductor Ecosystem – bit by bit

Devendra Kumar -
India is pursuing an ambitious strategy and policy to become a global nucleus for semiconductor design, manufacturing, and technology development. For that India has...
Electronics

Foxconn unit setting up $200 Million Electronic Components Plant in Tamil Nadu

Sakshi Jain -
A subsidiary of Foxconn, the prominent Taiwanese electronics manufacturing giant, is reportedly considering a significant investment of up to $200 million to establish an...
Automotive

How to achieve high efficiency and miniaturization in motor applications

ELE Times Report -
Energy efficiency is becoming more and more important to solve global environmental problems and realize a sustainable society which makes energy-saving technologies ever more...
Automation

Cadence Design Systems: Delivering world-class computational software capabilities for designing of electronic systems

Sakshi Jain -
Cadence Design System is the one-stop shop for proven design flows in multi-chipset design and advanced IC packaging. The Cadence 3D-IC solution provides 3D...
Press Release

Applied Materials Advances Heterogeneous Chip Integration with New Technologies for Hybrid Bonding and Through-Silicon...

Saurabh Bhuria -
New materials and systems enable chipmakers to increase the performance and reliability of hybrid bonding, the industry’s most advanced interconnect technology New deposition...
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