HomeNewsIndia NewsHigh-Speed Computing at 25 Gbps and beyond by TE Connectivity’s new Interconnects

    High-Speed Computing at 25 Gbps and beyond by TE Connectivity’s new Interconnects

    Mouser Electronics, Inc., the industry’s leading New Product Introduction (NPI) distributor with the widest selection of semiconductors and electronic components, is now stocking the Sliver internal cabled interconnects from TE Connectivity (TE), a global leader in connectivity and sensors. Helping to address the latest high-speed demands in networking, TE’s Sliver internal cabled interconnects offer improved performance and extended reach while also saving space and lowering design costs for data rate signals within a variety of data communication platforms.

    TE’s Sliver internal cabled interconnects, available from Mouser Electronics, address expanding network challenges experienced by designers by providing a flexible, robust and cost-effective system that can help manage large workloads and higher data rates (at 25 Gbps and beyond) and support longer-term data growth. Designed to work alongside a cable assembly as a surface-mounted connector with an exceptionally small footprint, Sliver internal cabled interconnects enable designers to make a seamless, simple connection from point A to point B by incorporating a high-density connector and cable assembly that routes high-speed signals from the microprocessors to other locations such as other boards, microprocessor chips, and inputs/outputs (I/O). This solution helps eliminate the need for re-timers and costlier, lower-loss printed circuit board (PCB) materials, simplifying design and lowering overall costs.

    Delivering excellent return loss and crosstalk performance, all while providing a low-loss link, TE’s Sliver internal cabled interconnects can be used across many 85- and 100-Ohm applications, data rates and protocols (including Ethernet, PCIe, SAS, SATA and InfiniBand). The unique robust metal housing on the connector cage helps withstand cable pull, and an active latch on the housing provides additional connection security. All Sliver internal cabled interconnects support present and future bandwidth needs without requiring re-qualification and redesign.

    TE’s Sliver internal cabled interconnects are available in a super-slim design with a 0.6 mm contact pitch. Target applications include data center and networking equipment, such as routers, switches, servers, high-performance computing (HPC), and storage devices.

    To learn more, visit http://www.mouser.com/new/TE-Connectivity/te-sliver-internal-cabled-connector/.

    ELE Times Bureau
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