The sixth edition of IEEE WINTECHCON 2025 convened over 800 women engineers, technologists, industry leaders, academia, students, and researchers from November 12 – 13, 2025, under the theme “Transforming the Future with Data-Driven Innovations in the Semicon-Verse.”
Organized by IEEE Bangalore Section, IEEE CAS Bangalore Chapter, and Women in Engineering AG Bangalore Section, the conference was hosted by Samsung Semiconductor India Research (SSIR), this year.
Dr. Chandrakanta Kumar, Chair of the IEEE Bangalore section, said, “IEEE Wintechcon 2025 showcased the strength and momentum of India’s semiconductor innovation engine. The shift toward data-driven and AI-enabled design is redefining what is possible in chip and system development, and this forum brought together the leaders shaping that future. The strong industry and academic participation reflects a clear belief that advancing semiconductor technology demands both technical excellence and inclusive leadership”.
The conference featured keynotes by Jaya Jagadish, Country Head and Senior Vice President of Silicon Design Engineering at AMD; Rajesh Krishnan, Senior Vice President and Managing Director, SSIR; Savithri Seetharaman, Vice President at Texas Instruments; and Sonali Jayswal, Director of System Software at NVIDIA. Garima Srivastava (SSIR) and Puneet Mishra (IEEE) served as the General Chairs for this event.
Rajesh Krishnan, Senior Vice President and Managing Director, SSIR. “Hosting IEEE Wintechcon 2025 was a privilege to showcase the engineering excellence driving the next generation of semiconductor and systems innovation. India stands at a pivotal juncture — with exceptional talent and strong technical rigor, the sector is poised to lead globally. At SSIR, we are advancing this trajectory through cutting-edge R&D, long-term ecosystem partnerships, democratising AI adoption and a focused commitment to nurturing women engineers into technical and product leadership roles that will shape the industry’s future.”
Key takeaways
The two-day program included deep technical sessions across both virtual and in-person formats. Tracks such as “Intelligent Silicon” and “Interstellar Innovations” covered GenAI-powered digital twins, 3D IC integration, advanced packaging, and design-for-test architectures, featuring speakers from Samsung, IBM, Western Digital, Cadence, and Texas Instruments. Day two hosted five parallel paper tracks on AI accelerators, embedded systems, VLSI architectures, and semiconductor packaging, complemented by technology booths, poster sessions, and hands-on demos. A special Masterclass, “From Engineer to Executive,” offered career and leadership insights for emerging women in STEM.
The next edition of IEEE WINTECHCON will be held in November 2026, in Bengaluru, India.
