At PCIM Europe 2026 in Nuremberg, Infineon Technologies AG showcases its comprehensive semiconductor portfolio for future-proof power infrastructure, AI data centers, robotics, and electromobility. The company presents a broad range of power system solutions spanning silicon (Si), silicon carbide (SiC), and gallium nitride (GaN) semiconductors, with support of software, tools, and cybersecurity expertise.
Infineon’s PCIM 2026 demo highlights:
- Making power infrastructure future-proof: As renewable energy continues to scale, robust power infrastructure is essential to support energy-intensive applications like AI data centers and advance factories. At PCIM, Infineon demonstrates its semiconductor technologies for efficient battery storage systems, uninterruptible power supplies, Solid-State Transformers (SST), and Solid-State Circuit Breakers (SSCB). Highlights include a demo stack for SSTs, along with SSCB components based on CoolSiC JFET technology, enabling fault isolation within microseconds and delivering high robustness for future DC grids.
- Powering AI from grid to core: Rapidly rising AI computing workloads are driving a sharp increase in data center energy demand and accelerating the shift toward new power architectures such as HVDC sidecars and DC microgrids. At PCIM, Infineon presents a comprehensive portfolio of Si, SiC, and GaN supporting this transformation from grid connection to processor core. Exhibits include power semiconductors, drivers, microcontrollers, and sensors for the latest power supply units, as well as solutions for battery backup units, intermediate bus converters, voltage regulation, and intelligent protection devices.
- Shaping the future of electromobility: Infineon is advancing electromobility as the global market leader in automotive semiconductors. PCIM highlights the link of this area, including solutions for traction inverters, DC-DC converters, on-board chargers, and battery management systems. Visitors can explore the company’s “One Inverter, One Infineon” system solution to improve drivetrain efficiency while optimizing space and cost. Additional demos showcase CoolSiC and CoolGaN power switches, the new EasyPACK S and CIPOS Prime module solutions, XENSIV sensors, and AURIX TC4xx microcontrollers.
- Empowering robotics: Robots are rapidly evolving toward physical AI systems that can sense, think, and act. At PCIM, Infineon will showcase semiconductor solutions supporting this evolution across industrial and domestic robots, humanoids, and drones. Demos include high‑efficiency motor control and power management solutions based on CoolGaN power semiconductors, PSOC Control C3 microcontrollers, and XENSIV sensors, enabling compact designs, precise control, and robust operation in future robotic applications.
- EU Cyber Resilience Act: Infineon highlights its commitment to security. At PCIM, experts will address upcoming regulatory requirements of the EU Cyber Resilience Act, illustrating how secured‑by‑design semiconductor solutions enable customers to meet compliance demands while strengthening product differentiation.
Infineon also contributes to the PCIM conference program and the various expo stages. An overview of all presentations by Infineon experts is available at www.infineon/pcim.
