HomeNewsIndia NewsMetal Printing on Stretchable Sheets: Future of Electronics?

    Metal Printing on Stretchable Sheets: Future of Electronics?

    Scientists have developed a technique for directly printing metal circuits, to create flexible, stretchable electronics.

    The technique can use multiple metals and substrates and is compatible with existing manufacturing systems that employ direct printing technologies.

    “Flexible electronics hold promise for use in many fields, but there are significant manufacturing costs involved – which poses a challenge in making them practical for commercial use,” said Jingyan Dong, from North Carolina State University in the US.

    “Our approach should reduce cost and offer an efficient means of producing circuits with high resolution, making them viable for integrating into commercial devices,” Dong said.

    The technique uses existing electrohydrodynamic printing technology, which is already used in many manufacturing processes that use functional inks.

    However, instead of ink, researchers used molten metal alloys with melting points as low as 60 degrees Celsius.

    The researchers have demonstrated their technique using three different alloys, printing on four different substrates: one glass, one paper, and two stretchable polymers.
    “This is direct printing. There is no mask, no etching, and no molds, making the process much more straightforward,” Dong said.

    The researchers tested the resilience of the circuits on a polymer substrate and found that the circuits conductivity was unaffected even after being bent 1,000 times.
    The circuits were still electrically stable even when stretched to 70 % of tensile strain.

    The researchers also found that the circuits are capable of “healing” themselves if they are broken by being bent or stretched too far.

    “Because of the low melting point, you can simply heat the affected area up to around 70 degrees Celsius and the metal flows back together, repairing the relevant damage,” Dong said.

    The researchers demonstrated the functionality of the printing technique by creating a high-density touch sensor, fitting a 400-pixel array into one square centimetre.

    “We’ve demonstrated the resilience and functionality of our approach, and were open to working with the industry sector to implement the technique in manufacturing wearable sensors or other electronic devices,” Dong said.

    ELE Times Research Desk
    ELE Times Research Deskhttps://www.eletimes.ai
    ELE Times provides a comprehensive global coverage of Electronics, Technology and the Market. In addition to providing in depth articles, ELE Times attracts the industry’s largest, qualified and highly engaged audiences, who appreciate our timely, relevant content and popular formats. ELE Times helps you build awareness, drive traffic, communicate your offerings to right audience, generate leads and sell your products better.

    LEAVE A REPLY

    Please enter your comment!
    Please enter your name here

    Related News

    Must Read

    Building Reliable 5G and 6G Networks Through Mobile Network Testing

    The development of communication networks has entered a revolutionary...

    Beyond the Screen: envisioning a giant leap forward for smartphones from physical objects to immersive experiences

    Author: STMicroelectronics Smartphones have become some of the most ubiquitous...

    Microchip’s SkyWire Tech Enables Nanosecond-Level Clock Sync Across Locations

    To protect critical infrastructure systems, SkyWire technology enables highly...

    Next Generation Hybrid Systems Transforming Vehicles

    The global automotive industry is undergoing a fundamental transformation...

    Tobii and STMicroelectronics enter mass production of breakthrough interior sensing technology

    Tobii and STMicroelectronics announced the beginning of mass production...

    Rohde & Schwarz unveils compact MXO 3 oscilloscopes with 4 and 8 channels

    Rohde & Schwarz expands its next-generation MXO oscilloscope portfolio...

    TI’s new power-management solutions enable scalable AI infrastructures

    Texas Instruments (TI) debuted new design resources and power-management...

    ESA awards Rohde & Schwarz for contributions to 30 years European Satellite Navigation

    The event brought together institutional and industrial partners, ESA...

    STMicroelectronics joins FiRa board, strengthening commitment to UWB ecosystem and automotive Digital Key adoption

    STMicroelectronics, a global semiconductor leader serving customers across the...