HomeNewsMicrochip and Acacia Collaborate to Enable Optimized Terabit-Scale Data Center Interconnect...

Microchip and Acacia Collaborate to Enable Optimized Terabit-Scale Data Center Interconnect Systems

The companies enable an interoperable coherent optics ecosystem that can help streamline the development of data center interconnect and metro transport systems

The latest data center architectures and increased traffic are driving higher bandwidth requirements between data centers. To address this challenge, system developers must streamline the development of a new generation of 1.2 Tbps (1.2T) transport solutions across a wide range of client configurations. This requires that today’s terabit-scale Ethernet PHY devices and coherent optical modules interoperate with each other in Data Center Interconnect (DCI) and metro transport networks. Microchip Technology today announces that it has worked with Acacia to demonstrate the fourth generation of interoperability between Microchip’s META-DX2 Ethernet PHY family and Acacia’s Coherent Interconnect Module 8 (CIM 8).

The two companies’ interoperable devices enable low-power, bandwidth-optimized, scalable solutions for pluggable optics in DCI and transport networks. They deliver three key benefits as they jointly enable high-capacity, multi-rate muxponders for optical transport platforms:

  • Optimized DCI bandwidth: The META-DX2 family, through its META-DX2+ PHY, uses its unique Lambda Splitting feature to split 400 GbE or 800 GbE clients across multiple wavelengths driven by the CIM 8 modules. This maximizes the capacity between data centers in rate configurations such as 3×800 GbE over 2×1.2 Tbps waves or 5×400 GbE over 2×1.0 Tbps waves.
  • Reduced design risk: Microchip and Acacia have jointly verified successful SerDes interoperation at up to 112G per lane for Ethernet and OTN clients, which reduces design validation and system qualification requirements.
  • Better support for full bandwidth, multi-rate operation: The META-DX2+ crosspoint and gearbox functions enable 100 GbE to 800 GbE client modules to connect with full bandwidth to CIM 8 modules.

“This interoperability extends a long-established partnership with Acacia to help accelerate and optimize the build-out of cloud computing and AI-ready optical networks while reducing development risk for our customers,” said Maher Fahmi, vice president for Microchip’s communications business unit. “Our META-DX2 is the first solution of its kind to integrate 1.6T of encryption, port aggregation and Lambda Splitting into the most compact 112G PAM4 device in the market.”

“With Acacia’s CIM 8 coherent modules verified to interoperate with Microchip’s META-DX2 devices, we see this as a robust solution that reduces system time-to-market,” said Markus Weber, senior director DSP product line management of Acacia. “The compact size and power efficiency of our CIM 8 coherent modules were designed to help network operators deploy and scale capacity of high-bandwidth DWDM connectivity between data centers and throughout transport networks.”

ELE Times Report
ELE Times Reporthttps://www.eletimes.ai/
ELE Times provides extensive global coverage of Electronics, Technology and the Market. In addition to providing in-depth articles, ELE Times attracts the industry’s largest, qualified and highly engaged audiences, who appreciate our timely, relevant content and popular formats. ELE Times helps you build experience, drive traffic, communicate your contributions to the right audience, generate leads and market your products favourably.

Related News

Must Read

Keysight Addresses Cross-Domain Physics Issues That Leave Electronic Designs Vulnerable to Late-Stage Failure

Keysight Technologies (NYSE: KEYS) today announced Keysight Multiphysics, a...

India Develops Indigenous Expendable Turbojet Engine for Future Missile System

In a breakthrough that will power the nation's aspirations...

STMicroelectronics Reports 26% Rise in Revenue, Bets Big on AI Data-centre Markets

According to STMicroelectronics, net revenues for the second quarter...

Rohde & Schwarz Presents New Software for Three-Phase Power Analysis on MXO Series Oscilloscopes

Rohde & Schwarz has introduced the new R&S MXO-K333 software...

DCP 800: Bosch expands its diesel testing technology range with a new pump test bench

Bosch is expanding its portfolio for diesel components with...

A New Wave of Chip Making, Phase 2 on the India Semiconductor Mission

The second phase of the India Semiconductor Mission has...

Tata Electronics to Manufacture India’s First Large-Scale Chip Factory

Tata Electronics, a group company under the $103 billion...

STM32U3B5/C5 With 2 MB of Flash and HSP, The 1st ULP STM32 to Run AI Without Batteries

The STM32U3B5/C5 are the first STM32U3 devices featuring 2 MB of...

India-UK Trade Agreement Opens New Opportunities for Electric Vehicle Industry in India

The effective implementation of India-UK Comprehensive Economic and Trade...