HomeLatest ProductsNew ProductsNew EiceDRIVER 1200 V half-bridge driver IC family with active Miller clamp...

    New EiceDRIVER 1200 V half-bridge driver IC family with active Miller clamp for optimized ruggedness in high power systems

    Following the introduction of the EiceDRIVER 6ED223xS12T 1200 V Silicon-on-Isolator (SOI) 3-phase gate driver family, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) is now expanding its portfolio with the EiceDRIVER 2ED132xS12x family. The half-bridge configuration of the driver IC family complements the existing 1200 V SOI series, offering customers more options and design flexibility. The increased output current capability extends the applicability of the portfolio to higher system power levels. The devices offer industry-leading negative VS transient immunity, shoot-through protection, undervoltage lockout and fast overcurrent protection. These features reduce the bill of materials and enable a more rugged design with a compact form factor suitable for high power applications such as commercial HVAC systems, heat pumps, servo drives, industrial inverters, pumps and fans up to 10 kW.

    EiceDriver DSO-16

    These half-bridge driver ICs include four versions in two different packages: The 2ED132xS12M comes in a DSO-16 300 mil package and provides +2.3 A / -4.6 A current capability. While the 2ED132xS12P comes in a DSO-20 300 mil package and supports +2.3 A / -2.3 A current drive capability. The family features best-in-class switching performance in packages with sufficient creepage and clearance distances. These products integrate a low resistance (30 Ω) bootstrap diode, ultra-fast and accurate (± 5 percent tolerance) overcurrent protection (OCP), enable input, fault-out, and programmable fault reset with separate logic (VSS) and output ground (COM) pins. The 2ED132xS12M variant provides additional features of Active Miller Clamp (AMC) and Short Circuit Clamp (SCC).

    Infineon’s SOI technology eliminates the parasitic thyristor structure and provides excellent robustness and immunity to negative transient voltages on the VS pin. This results in guaranteed immunity to -VS transients of 100 V during repeated 700-ns pulses. In addition, the devices are RoHS compliant and resistant to electrostatic discharge (ESD) and moisture.

    ELE Times Report
    ELE Times Reporthttps://www.eletimes.ai/
    ELE Times provides extensive global coverage of Electronics, Technology and the Market. In addition to providing in-depth articles, ELE Times attracts the industry’s largest, qualified and highly engaged audiences, who appreciate our timely, relevant content and popular formats. ELE Times helps you build experience, drive traffic, communicate your contributions to the right audience, generate leads and market your products favourably.

    Related News

    Must Read

    Qualitas Semiconductor Picks Anritsu’s Vector Network Analyzer for High-Speed Interconnect Signal Integrity Verification

    Qualitas Semiconductor Co., Ltd., a leading developer specialising in...

    The Tomorrow for AI and India’s edge advantage

    Courtesy: Qualcomm Artificial intelligence is entering its next chapter, one...

    Posifa Technologies Introduces PVC4001-C MEMS Pirani Vacuum Transducer for Wide-Range Vacuum Measurement

    Posifa Technologies has introduced its new PVC4001-C MEMS Pirani vacuum...

    STMicroelectronics to support AI infrastructure demand with high-volume production of its industry-leading silicon photonics platform

    STMicroelectronics is now entering high-volume production for its state-of-the-art...

    Impact of AI on Computing and the Criticality of Testing

    Courtesy: Teradyne Artificial intelligence (AI) is transforming industries, enhancing our...

    Disruptions from Wide Bandgap Continue Turbulence

    Courtesy: Avnet When we experience major shifts in the technology...

    Securing Humanoid Robotics with TPM-Anchored FPGAs

    Courtesy: Lattice Semiconductor The humanoid robotics market is rapidly transitioning...

    Keysight Expands Digital‑Layer Error Performance Validation for High‑Speed 1.6T Interconnects in AI Data Centres

    Keysight Technologies, Inc. introduced the Functional Interconnect Test Solutions (FITS) portfolio...

    CEA-Leti and NcodiN Collaborate on 300 mm Silicon Photonics for Bandwidth-Consuming AI Interconnects

    CEA-Leti and NcodiN, a French deep-tech startup pioneering nanolaser-enabled...