HomeNewsIndia NewsNew killer feature for wireless connectivity introduced; Concurrent MiraMesh and Bluetooth operation

    New killer feature for wireless connectivity introduced; Concurrent MiraMesh and Bluetooth operation

    Today, Bluetooth is the number one technology for short range point-to-point connectivity for smart devices, but it is not suitable for creating a reliable building-wide network. It simply lacks the scalability and range needed to offer complete coverage of today’s commercial and industrial buildings.

    The common solution to the problem has been to simply add two wireless chips into the product (a Bluetooth-chip for user interaction and another chip for the building-wide network) – adding cost, hardware size and complexity and increasing the power consumption of the device.

    In the connectivity industry, it has been a well-known fact that running multiple protocols with stringent timing requirements, concurrently on the same chip by time-sharing the radio, poses a huge challenge. LumenRadio’s Research and Development team has through dedicated and hard work now cracked the nut and solved the problem. Through the latest release of MiraOS it is now possible to, on the same chip, concurrently combine Bluetooth with the ultra-reliable, low energy, IPv6 capable, meshing network of MiraOS.

    Enabling smart device interactions

    What this means is that interactions between a wireless product and a smart device is now possible at the same time as the wireless mesh network is being fully operational. Concurrent Bluetooth operation opens up many desired possibilities such as intuitive and hassle-free commissioning and maintenance, locally extracting larger data sets, or possibilities for end user interactions through a smartphone or tablet.

    User interactions on the edge within a smart building solution is becoming increasingly important, as we see a trend where workplaces, buildings and production flows are no longer static – rather dynamic, with a need to allow more frequent and easy user interaction with all kinds of equipment. Local control loops can enable individual preferences, something that tomorrow’s activity-based workplaces will require.

    “Enabling concurrent Bluetooth and MiraMesh connectivity will give our customers the best of two worlds. This feature can unleash their creativity for smooth, intuitive user experiences while not compromising on reliability and performance. Life at the edge will never be the same again,” said Niclas Norlén, CTO, LumenRadio.

    “Combining Bluetooth and ultra-low energy 6lowpan mesh operation concurrently in the MiraMesh stack has been a complex challenge to solve. Knowing how hard it is to run multiple protocol with stringent timing requirements, concurrently on the same chip makes me even prouder of my team. The knowledge, effort and hard work they have showed in this project is impressive,” said Michael Karlsson, R&D manager, LumenRadio.

    At LumenRadio we see an ever-increasing demand for concurrent Bluetooth operation and by adding this to our MiraOS we offer the most reliable, low energy consumption and Future proof wireless technology on the market.

    For more information, visit: www.lumenradio.com

    ELE Times Research Desk
    ELE Times Research Deskhttps://www.eletimes.ai
    ELE Times provides a comprehensive global coverage of Electronics, Technology and the Market. In addition to providing in depth articles, ELE Times attracts the industry’s largest, qualified and highly engaged audiences, who appreciate our timely, relevant content and popular formats. ELE Times helps you build awareness, drive traffic, communicate your offerings to right audience, generate leads and sell your products better.

    Related News

    Must Read

    Global Semiconductor Revenue Grew 21% in 2025, reports Gartner

    Worldwide semiconductor revenue totalled $793 billion in 2025, an...

    India aims to be among the major semiconductor hubs by 2032, says Union Minister Ashwini Vaishnaw

    India has joined the global race to manufacture semiconductor...

    AI Glasses: Ushering in the Next Generation of Advanced Wearable Technology

    Courtesy: NXP Semiconductors   AI integration into wearable technology is...

    The semiconductor technology shaping the autonomous driving experience

    Courtesy: Texas Instruments Last summer in Italy, I held...

    The electronics Industry in 2026 and Beyond: A Strategic Crossroads

    As we stand on the threshold of 2026, the...

    Keysight & Samsung: Industry-First NR-NTN S-Band & Satellite Mobility Success

    Keysight Technologies announced a groundbreaking end-to-end live new radio non-terrestrial...

    Quantum Technology 2.0: Road to Transformation

    Courtesy: Rhode & Schwarz After more than 100 years of...

    Develop Highly Efficient X-in-1 Integrated Systems for EVs

    Courtesy: Renesas The recent tightening of CO2 emission regulations has...

    Cadence to deliver pre-validated chiplet solutions to Accelerate Chiplet Time to Market

    Cadence announced a Chiplet Spec-to-Packaged Parts ecosystem to reduce...