HomeNewsIndia NewsNew MSP430 MCUs offer configurable signal-chain elements for sensing applications

    New MSP430 MCUs offer configurable signal-chain elements for sensing applications

    Texas Instruments (TI) announced the addition of new microcontrollers (MCUs) with integrated signal-chain elements and an extended operating temperature range to its MSP430 value line portfolio. New MSP430FR2355 ferroelectric random access memory (FRAM) MCUs allow developers to reduce printed circuit board (PCB) size and bill-of-materials (BOM) cost while meeting temperature requirements for sensing and measurement in applications such as smoke detectors, sensor transmitters and circuit breakers.

    Features and benefits of the MSP430FR2355 MCUs

    • Signal-chain configurability: Engineers can enjoy more flexibility in their system design with MSP430FR2355 MCUs, which integrate smart analog combos – configurable signal-chain elements that include options for multiple 12-bit digital-to-analog converters (DACs) and programmable gain amplifiers, along with a 12-bit analog-to-digital converter (ADC) and two enhanced comparators.
    • Extended temperature range: Developers can use MSP430FR2355 MCUs for applications that require operation at temperatures as high as 105°C while also benefiting from FRAM data-logging capabilities.
    • MSP430 value line portfolio scalability: Engineers gain more options to select the right memory and processing speed for cost-sensitive applications with the MSP430FR2355 MCUs, which add options to the MSP430 value line FRAM MCU family by offering memory up to 32 KB and central processing unit (CPU) speeds up to 24 MHz. Designers can also scale to the rest of the MSP430 FRAM MCU portfolio for applications that require up to 256 KB of memory, higher performance or more analog peripherals.

    Pricing and availability

    Developers can start evaluating with the MSP430FR2355 MCU LaunchPad development kit (MSP-EXP430FR2355), available for US$12.99 from the TI store.

    ELE Times Research Desk
    ELE Times Research Deskhttps://www.eletimes.ai
    ELE Times provides a comprehensive global coverage of Electronics, Technology and the Market. In addition to providing in depth articles, ELE Times attracts the industry’s largest, qualified and highly engaged audiences, who appreciate our timely, relevant content and popular formats. ELE Times helps you build awareness, drive traffic, communicate your offerings to right audience, generate leads and sell your products better.

    LEAVE A REPLY

    Please enter your comment!
    Please enter your name here

    Related News

    Must Read

    Outages Won’t Wait: Why Grid Modernization Must Move Faster

    Courtesy: Keysight Technologies A routine click on a recommended...

    The Unsung Hero: How Power Electronics is Fueling the EV Charging Revolution

    The electrifying shift towards Electric Vehicles (EVs) often dominates...

    Emerging Technology Trends in EV Motors

    Electric Vehicles (EVs), central to the global climate transition,...

    Terahertz Electronics for 6G & Imaging: A Technical Chronicle

    As the demand for more spectrum increased with the...

    When Tiny Devices Get Big Brains: The Era of Edge and Neuromorphic AI

    From data-center dreams to intelligence at the metal Five years...

    Inside the Hardware Lab: How Modern Electronic Devices Are Engineered

    The engineering of contemporary electronic devices reflects a convergence...

    EDOM Seminar Explores the Next Generation of Physical AI Robots Powered by NVIDIA Jetson Thor

    The wave of innovation driven by generative AI is...

    Nuvoton Releases Compact High-Power Violet Laser Diode (402nm, 1.7W)

    Nuvoton Technology announced today the launch of its compact...

    “AI is Transforming the Semiconductor Value Chain End-to-End,” Says RS Components’ Amit Agnihotri

    India’s semiconductor ambitions are backed by initiatives like the...