HomeIndustryAutomotiveROHM Supplies Full SiC Power Modules to Formula-E racing team Venturi

    ROHM Supplies Full SiC Power Modules to Formula-E racing team Venturi

    ROHM has announced to provide the full SiC power modules to the VENTURI Formula E team in the FIA Formula E 2017–2018 (season four), the leading racing event for electric vehicles which will start on December 2nd and 3rd in Hong Kong. This module will support further improvements in the machine’s performance under racing conditions.

    As the leading developer of SiC power devices, ROHM became VENTURI’s official technology partner in season 3 and provides the world’s most advanced SiC power devices used in the inverter, which is the core of the electric vehicle powertrain.

    The inverter for season four features embedded full SiC Power module, making it 43% smaller and 6 kg lighter than the inverter for season two.

    ROHM will continue making technological advancement in power devices, contributing to the development of society.

    Inverter Comparison

    Formula E is an all-electric-powered FIA (Fédération Internationale de l’Automobile) championship that began in 2014. The series has expanded to cities around the world which has to date included metropolises such as Hong Kong, Berlin or New York and champions a clean environmental approach that does not use fossil fuels. The key to victory in this racing series for the drivers is to use power as efficiently as possible by getting the most performance out of the stored energy. The advancement in Formula E technology is expected to filter through developments to general-use electric vehicles. Although this motorsports event is still in its infancy, it already enjoys the participation of automotive manufacturers from around the world and major automobile manufacturers including those from Japan have declared their intention to join the race.

    For many years, ROHM has provided a highly varied lineup of products such as power supply ICs and various control ICs, along with discrete products such as power devices, current detection shunt resistors and so on for use in automobiles. ROHM is pushing forward with the latest cutting-edge development of SiC power devices, which are expected to realize dramatic loss reductions compared to conventional Si (silicon) power devices. These power devices will be used more and more on electric vehicle (EV) motors and inverters.

    Statements

    Franck Baldet, CTO, VENTURI Formula E Team

    “The Formula E is the only motorsports event for testing the latest technology in next-generation electric vehicles. We are extremely happy about our technical partnership with ROHM in the area of power management, which is the foremost key to the Formula E race.

    For season 4, by adopting a full SiC power module, we were able to bring to reality a lightweight inverter that requires only a minimum amount of space. By using the latest technology, I expect that we will be able to dramatically reduce our lap times, and I hope that we can continue to move forward with revolutions in technology through our partnership with ROHM.”

    Kazuhide Ino, Group General Manager of Power Device Production Headquarters, ROHM Co., Ltd.

    “ROHM has been providing products for many years for today’s constantly evolving automobiles, with quality to our main advantage. This is currently a field in which we would like to give our special attention, and semiconductor devices are certain to play a crucial role in recent hybrid and electric automobiles.

    The SiC power device that we are providing for the Formula E racing car is one example. We provided SiC-SBDs in season 3 last year (2016–2017), but this year we provide full SiC power modules that combine SiC-SBD and SiC MOSFET. These modules will contribute to improving vehicle performance. I hope that we can continue to contribute to society through the efficient conversion of energy in a wide range of industries and fields, starting with electric vehicles.”

    The Advantage of Using SiC Products

    The SiC power module used in the inverter of the VENTURI Formula E team racing car achieves a large power throughput, owing to the development of a new package with an improved internal module structure, as well as an optimized thermal management. Compared to conventional IGBT modules with similar current ratings, this module reduces switching losses by 75% (at a chip temperature of 150°C). This contributes to the energy efficiency of the whole application. Also, having more compact peripheral components throughout the high-frequency drive, as well as the effect of reductions in switching losses contributes to a more compact cooling system as well.

    By using this full SiC power module in the inverter section (the powertrain core), it makes the inverter 43% smaller and 6kg lighter than in season two. Even compared to the previous inverter used in season three, it is 30% smaller and 4kg lighter.

    ELE Times Research Desk
    ELE Times Research Deskhttps://www.eletimes.ai
    ELE Times provides a comprehensive global coverage of Electronics, Technology and the Market. In addition to providing in depth articles, ELE Times attracts the industry’s largest, qualified and highly engaged audiences, who appreciate our timely, relevant content and popular formats. ELE Times helps you build awareness, drive traffic, communicate your offerings to right audience, generate leads and sell your products better.

    Related News

    Must Read

    Adoption of Electric Motorcycles: A Challenging Ride Ahead

    India’s tryst with electric two-wheelers began as early as...

    Edge AI Chipsets: How On-Device Intelligence Is Reshaping Embedded System Design

    The cloud-first model for embedded systems is becoming a...

    Quantum-Safe Hardware: Why the Cybersecurity Deadline Is Closer Than the Quantum Breakthrough

    The world’s digital infrastructure is quietly approaching a cryptographic...

    SQL Server IoT 2025: Why It Matters for Embedded and OEM Systems

    Courtesy: Arrow Electronics The new SQL Server IoT 2025 is...

    Microchip Releases Plastic Transient Voltage Suppressors for A&D Applications

    Microchip Technology announced the release of its JANPTX family...

    Týr-the-Pruner: Search-based Global Structural Pruning for LLMs

    Courtesy: AMD Key Takeaways: End-to-end global structural pruning: Týr-the-Pruner...

    Global Semiconductor Revenue Grew 21% in 2025, reports Gartner

    Worldwide semiconductor revenue totalled $793 billion in 2025, an...

    India aims to be among the major semiconductor hubs by 2032, says Union Minister Ashwini Vaishnaw

    India has joined the global race to manufacture semiconductor...

    AI Glasses: Ushering in the Next Generation of Advanced Wearable Technology

    Courtesy: NXP Semiconductors   AI integration into wearable technology is...

    The semiconductor technology shaping the autonomous driving experience

    Courtesy: Texas Instruments Last summer in Italy, I held...