HomeNewsIndia NewsSTMicroelectronics Simplifies Creation of Alexa Built-In Smart Home Devices with Amazon-Qualified Reference...

    STMicroelectronics Simplifies Creation of Alexa Built-In Smart Home Devices with Amazon-Qualified Reference Design

    STMicroelectronics (NYSE: STM) has released an Amazon-qualified reference design package for smart connected devices leveraging Alexa Voice Service (AVS) Integration for AWS IoT Core, which can be used to create Alexa Built-in products using simple microcontrollers (MCUs).

    AVS Integration for AWS IoT Core has the ability to transform the way users interact with smart “things,” bringing cloud-based Alexa experiences to items such as toasters, cookers, thermostats, blinds, hairdryers, and many others with no need for significant investment in electronic hardware. This could hasten the end for traditional buttons and dials, leading to new generations of products that offer easy and natural user interactions, adaptable smart features, and access to cloud services such as cooking advice or reordering of consumables.

    ST’s Amazon-qualified solution jump-starts the design of Alexa-enabled appliance controllers, with Alexa voice-user-interface software already integrated on high-performing MCUs of the STM32* family. The energy-efficient STM32, being the world’s most successful 32-bit Arm® Cortex®-M MCU family, is ideal for low-cost, small, and simple connected devices that require state-of-the-art features such as far-field audio capture and natural-language understanding.

    “We believe the AVS Integration for AWS IoT Core can revolutionize users’ expectations of smart devices by enabling easier access to their powerful features and delivering more rewarding experiences,” said Daniel Colonna, Marketing Director, Microcontroller Division, STMicroelectronics. “Our reference design leverages the inherent strengths of STM32 microcontrollers and the supporting solution to enable cost-efficient products with unbeatable functionality, small size, and fast time to market.”

    Unlike other devices commonly used for Alexa products, such as digital signal processors (DSPs) and flashless processors, STM32 MCUs integrate all necessary system features including powerful audio front-end processing, local wake-word detection, communication interfaces, and memory, including RAM and Flash, in a single chip. This integration enables the board to have small dimensions and a simple layout for cost-effective deployment in customers’ end products.

    The audio front end delivers outstanding far-field voice detection, even in noisy environments and with closely spaced microphones. Created by ST Authorized Partner DSP Concepts, distributed by ST as part of the STM32 MCU and supported by ST channels, the front end comes with a free Audio Weaver tool license to help users easily fine-tune their designs.

    The STM32H7’s combination of large internal RAM and Flash, peripheral integration, and high-speed processor enables TalkTo, our high-performance audio front-end, to drive significantly better performance in real-time,” said Paul Beckmann, DSP Concepts Founder and CTO. “TalkTo is delivered through Audio Weaver, so product makers can quickly design, develop and deploy a wide range of voice-enabled products.”

    Leveraging the features of the high-performance STM32 microcontrollers, users can customize and scale their designs by adding enhancements such as a second wake word, extra local commands, and a graphical display to combine with the voice-command capability for an even more compelling user experience.

    Further simplifying prototyping and development, the reference design hardware includes an audio daughter board as a separate module. This contains an ST FDA903D audio codec, user LEDs and buttons, and two MP23DB01HP MEMS microphones spaced at 36mm for size-constrained products such as power switched plugs. The hardware’s modularity lets users implement a custom daughter board if application-specific mic spacing, acoustics, and user-interface definitions are needed.
    The reference design includes fully developed software that provides the features needed to support Alexa products, including:

    • Audio-capture software
    • Advanced Audio Front End (AFE) with noise reduction, echo cancellation and advanced beam-forming signal processing for far-field audio detection
    • Amazon “Alexa” Wake Word
    • Connectivity to AWS IoT
    • Audio output software

    Working with this reference design enables product designers to certify new end products with AVS faster and more easily than bringing up the entire system independently. Both the hardware and software content can be easily adapted to support individual customers’ new-product concepts.

    The bill of materials (BOM) for the reference design is engineered to be less than $10 when purchasing the components in high volumes. Please contact your ST sales office for pricing options and sample requests.

    For more information, visit blog.st.com

    ELE Times Bureau
    ELE Times Bureauhttps://www.eletimes.ai/
    ELE Times provides a comprehensive global coverage of Electronics, Technology and the Market. In addition to providing in depth articles, ELE Times attracts the industry’s largest, qualified and highly engaged audiences, who appreciate our timely, relevant content and popular formats. ELE Times helps you build awareness, drive traffic, communicate your offerings to right audience, generate leads and sell your products better.

    LEAVE A REPLY

    Please enter your comment!
    Please enter your name here

    Related News

    Must Read

    Nuvoton Launches Arbel NPCM8mnx System-in-Package (SiP) for AI Servers and Datacenter Infrastructure

    Breakthrough BMC Innovation Powers Secure, Scalable, and Open Compute...

    STMicroelectronics joins FiRa board, strengthening commitment to UWB ecosystem and automotive Digital Key adoption

    STMicroelectronics has announced that Rias Al-Kadi, General Manager of the...

    NEPCON ASIA 2025: Showcasing the Future of Smart Electronics Manufacturing

    NEPCON ASIA 2025, taking place from October 28 to...

    Renesas Expands Sensing Portfolio with 3 Magnet-Free IPS ICs & Web-Based Design Tool

    New Simulation & Optimization Platform Enables Custom Coil Designs...

    IEEE IEDM, 2025 Showcases Latest Technologies in Microelectronics, Themed “100 Years of FETs”

    The IEEE International Electron Devices Meeting (IEDM) is considered...

    OMNIVISION Introduces Next-Generation 8-MP Image Sensor For Exterior Automotive Cameras

    OMNIVISION announced its latest-generation automotive image sensor: the OX08D20, 8-megapixel (MP) CMOS...

    Vishay Intertechnology Expands Inductor Portfolio with 2000+ New SKUs and Increased Capacity

    Vishay Intertechnology, Inc. announced that it has successfully delivered...

    Keysight to Demonstrate AI-enabled 6G and Wireless Technologies at India Mobile Congress 2025

    Keysight Technologies will demonstrate 20 advanced AI-enabled 6G and...

    Ashwini Vaishnaw Approves NaMo Semiconductor Lab at IIT Bhubaneswar

    As part of a big push towards the development...