HomeNewsIndia NewsThe brand new nanocomposite beats the heat in electronics

    The brand new nanocomposite beats the heat in electronics

    Researchers at Rice University’s Brown School of Engineering invented a nanocomposite, which is a promising high-temperature dielectric material for flexible electronics, energy storage and electric devices.

    One-dimensional polymer nanofibers and two-dimensional boron nitride nanosheets are combined by the nanocomposite. The nanofibers reinforce the self-assembling material while the white graphene-based nanosheets provide a thermally conductive network that allows it to withstand the heat that breaks down common dielectrics, the polarized insulators in batteries and other devices that separate positive and negative electrodes.

    Research scientist M.M. Rahman and postdoctoral researcher Anand Puthirath of the Ajayan lab led the study to meet the challenge posed by next-generation electronics: Dielectrics must be thin, tough, flexible and able to withstand harsh environments.

    “Ceramic is a very good dielectric, but it is mechanically brittle,” Rahman said of the common material. “On the other hand, polymer is a good dielectric with good mechanical properties, but its thermal tolerance is very low.”

    Boron nitride is an electrical insulator, but happily disperses heat, he said. “When we combined the polymer nanofiber with boron nitride, we got a material that’s mechanically exceptional, and thermally and chemically very stable,” Rahman said.

    The 12-to-15-micron-thick material acts as an effective heat sink up to 250 degrees Celsius (482 degrees Fahrenheit), according to the researchers. Tests showed the polymer nanofibers-boron nitride combination dispersed heat four times better than the polymer alone.

    In its simplest form, a single layer of polyaramid nanofibers binds via van der Waals forces to a sprinkling of boron nitride flakes, 10% by weight of the final product. The flakes are just dense enough to form a heat-dissipating network that still allows the composite to retain its flexibility, and even foldability, while maintaining its robustness. Layering polyaramid and boron nitride can make the material thicker while still retaining flexibility, according to the researchers.

    “The 1D polyaramid nanofiber has many interesting properties except thermal conductivity,” Rahman said. “And boron nitride is a very interesting 2D material right now. They both have different independent properties, but when they are together, they make something very unique.”

    “The material is scalable and should be easy to incorporate into manufacturing,” Rahman concluded.

    ELE Times Research Desk
    ELE Times Research Deskhttps://www.eletimes.ai
    ELE Times provides a comprehensive global coverage of Electronics, Technology and the Market. In addition to providing in depth articles, ELE Times attracts the industry’s largest, qualified and highly engaged audiences, who appreciate our timely, relevant content and popular formats. ELE Times helps you build awareness, drive traffic, communicate your offerings to right audience, generate leads and sell your products better.

    LEAVE A REPLY

    Please enter your comment!
    Please enter your name here

    Related News

    Must Read

    Nuvoton Launches Arbel NPCM8mnx System-in-Package (SiP) for AI Servers and Datacenter Infrastructure

    Breakthrough BMC Innovation Powers Secure, Scalable, and Open Compute...

    STMicroelectronics joins FiRa board, strengthening commitment to UWB ecosystem and automotive Digital Key adoption

    STMicroelectronics has announced that Rias Al-Kadi, General Manager of the...

    NEPCON ASIA 2025: Showcasing the Future of Smart Electronics Manufacturing

    NEPCON ASIA 2025, taking place from October 28 to...

    Renesas Expands Sensing Portfolio with 3 Magnet-Free IPS ICs & Web-Based Design Tool

    New Simulation & Optimization Platform Enables Custom Coil Designs...

    IEEE IEDM, 2025 Showcases Latest Technologies in Microelectronics, Themed “100 Years of FETs”

    The IEEE International Electron Devices Meeting (IEDM) is considered...

    OMNIVISION Introduces Next-Generation 8-MP Image Sensor For Exterior Automotive Cameras

    OMNIVISION announced its latest-generation automotive image sensor: the OX08D20, 8-megapixel (MP) CMOS...

    Vishay Intertechnology Expands Inductor Portfolio with 2000+ New SKUs and Increased Capacity

    Vishay Intertechnology, Inc. announced that it has successfully delivered...

    Keysight to Demonstrate AI-enabled 6G and Wireless Technologies at India Mobile Congress 2025

    Keysight Technologies will demonstrate 20 advanced AI-enabled 6G and...

    Ashwini Vaishnaw Approves NaMo Semiconductor Lab at IIT Bhubaneswar

    As part of a big push towards the development...