HomeNewsIndia Newsu-blox choosen as an Innovation Awards honoree

    u-blox choosen as an Innovation Awards honoree

    u-blox has announced that its SARA-R5 LTE-M module with IoT Security-as-a-Service has been distinguished as a CES 2021 Innovation Awards Honoree. The CES Innovation Awards program is an annual competition honouring outstanding design and engineering in consumer technology products.

    SARA-R5 LTE-M modules with IoT Security-as-a-Service make it extremely simple to protect your data, both on the device and during the transmission of data from the device to the cloud. Its out-of-the-box, simple, secure, and cost-effective onboarding process to leading cloud IoT platforms speeds up development, shortening time-to-market. The solution is specifically optimized for low power wide area (LPWA) deployments that use resource-constrained IoT devices.  

    By bringing all the technology building blocks in house and having full hardware and software ownership with its SARA-R5 IoT modules and Thingstream IoT service delivery platform, u‑blox can guarantee long-term device availability and provide lifetime support of the entire platform, from silicon to cloud.

    For more information, please visit https://www.u-blox.com/

    ELE Times Bureau
    ELE Times Bureauhttps://www.eletimes.ai/
    ELE Times provides a comprehensive global coverage of Electronics, Technology and the Market. In addition to providing in depth articles, ELE Times attracts the industry’s largest, qualified and highly engaged audiences, who appreciate our timely, relevant content and popular formats. ELE Times helps you build awareness, drive traffic, communicate your offerings to right audience, generate leads and sell your products better.

    Related News

    Must Read

    STMicroelectronics and Leopard Imaging use NVIDIA Jetson-ready multi-sensor module for robotics vision 

    STMicroelectronics and Leopard Imaging have introduced an all-in-one multimodal...

    Graphene in Focus: How Nanotechnology is Transforming Electronics?

    As miniaturisation and increasingly complex design architectures continue to...

    FormFactor and Rohde & Schwarz Advance their Partnership for on-wafer RF Component Characterisation

    FormFactor and Rohde & Schwarz have announced a strategic...

    Anritsu and SK Telecom Jointly Verify AI-Based Antenna Optimisation, POSTECH and Bluetest

    ANRITSU CORPORATION has jointly verified AI-based antenna optimisation technologies...

    Keysight Launches Local Manufacturing in India to Accelerate Global Innovation

    Keysight Technologies has announced plans to begin local manufacturing...

    Microchip Introduces Automotive-Qualified System-in-Package Hybrid MCU for Automotive and E-Mobility Human-Machine Interface Applications

    Automotive and E-Mobility designers are incorporating more Human-Machine Interfaces...

    Cadence and NVIDIA Collaborate on Accelerated Engineering Solutions for Agentic AI Chip and System Design​

    Cadence announced an expansion of its broad collaboration with NVIDIA to accelerate...

    TI unveils high-performance isolated power modules to advance power density in data centers and EVs

    Texas Instruments (TI) has unveiled new isolated power modules,...