HomeNewsIndia NewsUnveiling new openVPX backplanes for extreme environments

    Unveiling new openVPX backplanes for extreme environments

    Pixus Technologies, a provider of embedded computing and enclosure solutions, now offers a various OpenVPX backplanes utilizing the ultra-rugged KVPX style connector.   This type of connector is often used in the harshest Aerospace applications.

    The first in the series of Pixus KVPX backplanes is a 3U 3-slot version.  Compliant to the VITA 63.0 Hyperboloid Alternative Connector for VPX standard, the backplane features a BKP3-CEN03-15.2.9 routing profile.    Options include conformal coating and the installation of Rear Transition Module (RTM) connectors.  The initial design was built to support PCIe Gen3 speeds, but Pixus offers versions of its standard OpenVPX backplanes up to 100GbE.

    Pixus offers OpenVPX backplanes, chassis platforms, and specialty products.  The company also provides enclosure solutions in MicroTCA, cPCI Serial, AdvancedTCA, as well as instrumentation case formats.

    For more information, visit www.pixustechnologies.com

    ELE Times Research Desk
    ELE Times Research Deskhttps://www.eletimes.ai
    ELE Times provides a comprehensive global coverage of Electronics, Technology and the Market. In addition to providing in depth articles, ELE Times attracts the industry’s largest, qualified and highly engaged audiences, who appreciate our timely, relevant content and popular formats. ELE Times helps you build awareness, drive traffic, communicate your offerings to right audience, generate leads and sell your products better.

    Related News

    Must Read

    20 Years of EEPROM: Why It Matters, Needed, and Its Future

    ST has been the leading manufacturer of EEPROM for the 20th...

    Modern Cars Will Contain 600 Million Lines of Code by 2027

    Courtesy: Synopsys The 1977 Oldsmobile Toronado was ahead of its...

    Advancement in waveguides to progress XR displays, not GPUs

    Across emerging technology domains, a familiar narrative keeps repeating...

    Powering AI: How Power Pulsation Buffers are transforming data center power architecture

    Courtesy: Infineon Technologies Microsoft, OpenAI, Google, Amazon, NVIDIA, etc. are...

    Can the SDV Revolution Happen Without SoC Standardization?

    Speaking at the Auto EV Tech Vision Summit 2025,...

    ElevateX 2026, Marking a New Chapter in Human Centric and Intelligent Automation

    Teradyne Robotics today hosted ElevateX 2026 in Bengaluru -...

    The Architecture of Edge Computing Hardware: Why Latency, Power and Data Movement Decide Everything

    Courtesy: Ambient Scientific Most explanations of edge computing hardware talk...