HomeNewsOwl Autonomous Imaging 3D Thermal Sensor Named a 2023 Best of Sensors...

    Owl Autonomous Imaging 3D Thermal Sensor Named a 2023 Best of Sensors Award Winner

    Owl’s new HD thermal camera sensing technology and AI software will enable the automotive industry to meet the NHTSA’s new mandates for pedestrian safety at night.

    Owl Autonomous Imaging, The smartest choice for the road ahead, announced it has been named a winner in the Optical and Camera category of the 2023 Best of Sensors Awards for 3D High-Definition Thermal Ranger Camera with Computer Vision. The awards program is presented by Sensors Converge and Fierce Electronics and honors the best in sensor technologies and the sensor ecosystem, people and companies.

    Throughout the world, government agencies and industry organizations are in the process of developing and implementing automotive safety regulations that will force vehicle makers to adapt new safety and night-time driving technologies that are much more effective than those in use today. Owl’s Thermal Ranger™ combines the latest Thermal Camera hardware and AI technology that not only can “see” warm objects like humans, animals and bicyclists on the road, but can also classify them as to what they are and how far away they are, enabling the vehicles to automatically hit the brakes or steer around them.

    “Pedestrian safety, especially for night-time and urban driving, is THE critical milestone for the automotive industry’s next-generation vehicles, and we are honored to be recognized by Sensors Converge & Fierce Electronics for the impact of the problems we seek to solve” says Chuck Gershman, CEO & Co-founder of Owl Autonomous Imaging.

    Hero-OwlApril2023

    Submissions were judged based on the value to the marketplace, the impact of the problems it solves or issues it addresses and the uniqueness of the design.

    Charlene Soucy, Senior Director, Technology – Sensors & Electronics said, “Congratulations to the individuals, teams and technologies on their award wins. Each year we are continually amazed at the innovations and achievements the award winners have created.  This year, the winners have outdone themselves with their innovations and perseverance. We are excited to honor them as the best of the best in the industry.”

    ELE Times Report
    ELE Times Reporthttps://www.eletimes.ai/
    ELE Times provides extensive global coverage of Electronics, Technology and the Market. In addition to providing in-depth articles, ELE Times attracts the industry’s largest, qualified and highly engaged audiences, who appreciate our timely, relevant content and popular formats. ELE Times helps you build experience, drive traffic, communicate your contributions to the right audience, generate leads and market your products favourably.

    Related News

    Must Read

    Cadence and NVIDIA Collaborate on Accelerated Engineering Solutions for Agentic AI Chip and System Design​

    Cadence announced an expansion of its broad collaboration with NVIDIA to accelerate...

    TI unveils high-performance isolated power modules to advance power density in data centers and EVs

    Texas Instruments (TI) has unveiled new isolated power modules,...

    STMicroelectronics Unveils AI-Enabled ‘Stellar P3E’ MCU, Backs 28nm Strategy for Cost and Supply Chain Stability

    By Shreya Bansal, Sub-Editor STMicroelectronics introduced the Stellar P3E, a...

    R&S amplifiers enable high-field immunity testing expansion at IB Lenhardt Lab

    IBL Lab GmbH, the DAkkS (Deutsche Akkreditierungsstelle GmbH) accredited...

    Renesas Launches First Bidirectional 650V-Class GaN Switch For Multiple Uses

    Renesas Electronics Corporation, a premier supplier of advanced semiconductor...

    Microchip Announces New BZPACK mSiC Power Modules with HV-H3TRB Reliability Standards

    Microchip Technology has announced its BZPACK mSiC power modules,...

    Mythic and Microchip Partner to Redefine AI Processing with Next-Gen Analogue Compute-in-Memory Technology.

    Mythic has chosen memBrain neuromorphic hardware intellectual property (IP)...

    Thermal Management in 3D-IC: Modelling Hotspots, Materials, & Cooling Strategies

    Courtesy: Cadence As three-dimensional integrated circuit (3D-IC) technology becomes the...