Infineon Technologies AG announced that its AIROC CYW20829 Bluetooth LE microcontroller (MCU) and Software Development kit (SDK) are now verified as part of the Engineered for Intel Evo laptop accessory program, the first of its kind in the Bluetooth human interface device (HID) industry. Through this collaboration with Intel, vendors developing next generation HID devices can confidently “ditch the dongle” using CYW20829. With this new solution, designers can achieve a best-in-class direct-to-host connection which has been rigorously tested against Intel’s strict KPIs and experience requirements.
“At Infineon, we strive to provide a leading wireless experience and convenience to consumers and designers,” said Shantanu Bhalerao, Vice President of Wireless Products at Infineon Technologies. “With over two decades of wireless HID experience, we are delighted to support the Engineered for Intel Evo program with our CYW20829, optimizing the user experience for both vendors and customers by helping them to truly eliminate the dongle.”
The Intel Evo platform is Intel’s superior consumer brand for premium laptops. Designed to provide a premium computing experience, laptop designs that meet the Intel Evo requirements undergo rigorous testing measurement and verification to ensure they deliver exemplary performance in terms of responsiveness, battery life, charging capability, form factor, and more. Engineered for Intel Evo Laptop Accessories Program defines strict Intel requirements for Bluetooth PC Peripherals, maximizing the end-to-end user experience when paired with Intel Evo laptops.
“Wireless peripherals are essential ingredients for the execution of many of our day-to-day computing activities,” said Eric McLaughlin, VP & GM, Connectivity Solutions Group at Intel Corporation. “For this reason, Intel works closely with key partners to ensure their devices meet technical requirements in the areas of performance, reliability, and ease of use. We’re excited that the Engineered for Intel Evo accessory program is expanding to include Infineon’s AIROC CYW20829 Bluetooth LE MCU and SDK, further extending Intel’s industry collaboration towards the goal of enabling amazing end-to-end connected user experiences.”
Infineon’s CYW20829 Bluetooth LE microcontroller (MCU) was designed with HID applications in mind to include:
- RF Performance: Featuring a dual demodulator architecture, long-standing Rx Blocker IP, and link budget of 108 dB, CYW20829 delivers unprecedented wireless robustness.
- Power Optimization: CYW20829 delivers up to 20 percent better battery life over leading devices in the market through its ARM Cortex-M33 clocking at 48 or 96 MHz, hardware keyscan matrix to buffer user inputs without core activation, and superb Tx & Rx current consumption.
- Cost: Highly integrated and unburdened with unnecessary peripherals, the CYW20829 is cost competitive with low-cost package offerings and the ability to route on 2-layer non-HDI PCB.
- Security: CYW20829 features support for the emerging Cyber Resiliency Act (CRA) and Radio Equipment Directive (RED) security regulations which will be mandatory for wireless products being sold on the European market.
- Zephyr: Enabled and supported on CYW20829, Zephyr addresses the growing number of OEMs leveraging the operating system.
