Cadence (Nasdaq: CDNS) today introduced the AuraStack AI Super
Agent on Cadence Allegro AI Studio, the world’s first agentic AI platform for printed circuit board
(PCB) and advanced packaging design, taking designers from system planning to final product in a
single AI-native environment. The Cadence AuraStack AI Super Agent, accelerated by NVIDIA
Blackwell and NVIDIA CUDA-X, coordinates domain-specific AI agents across planning,
implementation and tightly integrated multiphysics analysis domains to compress the system-design
cycle through manufacturing. With the AuraStack AI Super Agent, Cadence is now the only provider
with agentic AI solutions spanning the full electronic system design flow, from digital and analog
silicon design, advanced packaging, through to PCB design, building on its ChipStack, InnoStack
and ViraStack AI Super Agents.
“The next era of AI infrastructure—spanning data centers, automotive, aerospace and physical
AI—will be defined not only by silicon, but by the systems that connect, power and cool it,” said
Michael Jackson, corporate vice president of R&D for System Design and Analysis at
Cadence. “As hyperscale data centers deploy massive AI clusters and other industries advance
increasingly intelligent, high-performance systems, engineering teams face growing complexity in
PCB and advanced package design. Agentic AI orchestration, combined with trusted EDA and SDA
tools, enables customers to move from manual iteration to intelligent, automated design realization.”
Agentic AI for Packaging and PCB Design
Building on the same architecture as Cadence’s ChipStack AI Super Agent, agentic AI is combined with principled simulation and optimization tools, leveraging a mental model of the design intent, to automate and orchestrate the design exploration, realization and signoff. The AuraStack AI Super Agent brings together automation and optimization for system planning, constraints management, physical structure definition, IP creation and reuse, place and route, design for manufacturability and multiphysics analysis across Cadence’s system design and analysis portfolio. It introduces a unified, AI-driven multiphysics foundation that concurrently models and optimizes electrical, thermal and mechanical behavior—including SI/PI, thermal, mechanical stress, drop, vibration and fatigue analysis—within a closed-loop environment, enabling earlier tradeoff evaluation and product-level optimization across the entire design flow. This continuous multiphysics feedback loop enables real- time design convergence, reducing late-stage surprises and improving overall system reliability.
The AuraStack AI Super Agent’s key benefits include:
- Accelerating time to market by 2X, with 15X productivity and multiphysics-driven
quality—automating complex tasks, expanding design exploration. - Unifying separate engineering teams around a shared, multiphysics-aware design
environment with a single source of truth across domains. - Advancing early and continuous multiphysics co-optimization to reduce late-stage
rework and costly design iterations. Unifies Cadence multiphysics signoff solutions, such as
Celsius Thermal Solver, Clarity 3D Solver for 3D-EM, MSC Nastran and Marc Linear
and Non-Linear Finite Element Analysis Solvers for mechanical analysis, and Sigrity X
Platform for signal and power integrity. - Limiting expensive respins by identifying system issues earlier in development.
- Enabling product-level optimization, including co-optimization with advanced packaging
approaches.
Industry Leaders Advancing Agentic AI with Cadence
Cadence is collaborating with industry leaders to deploy AuraStack AI Super Agent workflows for real-
world advanced IC packaging and PCB design challenges.
NVIDIA is using Cadence to help automate and optimize increasingly complex system design
workflows for its engineering teams.
“The scale and complexity of modern AI infrastructure demands a new design approach,” said Tim
Costa, vice president and general manager of computational engineering at NVIDIA. “NVIDIA’s
collaboration with Cadence is advancing AI-powered engineering workflows that accelerate design
convergence and innovation across the industry. The Cadence AuraStack AI Super Agent and the
Millennium M2000 Supercomputer deliver up to 20X faster multiphysics performance, giving our
engineers the capability to tackle the most demanding design challenges and bring the next
generation of AI infrastructure to life.”
Cadence is partnering with TSMC to help customers accelerate advanced package implementation
through AI-driven automation, enabling timely design convergence for increasingly complex multi-die
systems.
“As advanced packaging complexity grows, customers need new levels of automation to achieve
timely design convergence,” said Aveek Sarkar, director of the Ecosystem and Alliance
Management Division at TSMC. “Our long-standing partnership with Open Innovation Platform
(OIP) ecosystem partners like Cadence to deliver advanced package design and verification solutions
for TSMC 3DFabric technologies helps customers accelerate the realization of next-generation
multi-die systems for AI and high-performance computing applications. Through our multi-year
collaboration on substrate auto routing, we are already enabling customers to boost productivity by
100X while delivering quality of results similar to manual routing.”
Socionext is leveraging Cadence to accelerate the automation and optimization of increasingly
complex semiconductor package and PCB design workflows.
“AI-driven agents are set to transform IC package and PCB design by automating SI, PI and thermal
workflows and enabling generative design,” said Iwasaki Toshifumi, lead design execution leading
unit, Global Leading Group at Socionext Inc. “This acceleration allows our engineers to focus on
higher-value work like architecture exploration, margin optimization, and multiphysics tradeoffs, while
capabilities such as automated routing and chip-package-board co-design accelerate convergence
and reduce manual effort.”
FORVIA HELLA continues to advance intelligent, sustainable mobility solutions that will define the
future of automotive technology.
“Working closely with Cadence has fundamentally changed the way FORVIA HELLA develops
advanced automotive electronics. Using AI-assisted placement technology, a task involving the
placement of 300 components that previously took up to four days can now be completed in just four
minutes,” said Sven Hoenecke, president & CEO, Electronics NSA at FORVIA HELLA. “This step
change in productivity allows our engineers to evaluate more design alternatives, optimize layouts
earlier in the development process, and accelerate the development of innovative products without
compromising quality. By automating repetitive work, our teams can focus more time on solving
complex engineering challenges and bringing new technologies to market faster.”
Schneider Electric is collaborating with Cadence to apply AI-driven design automation and
engineering expertise to accelerate electronic design workflows and scale institutional knowledge
across engineering teams.
“At Schneider Electric, we see AI as much more than a productivity tool. Our collaboration with
Cadence has demonstrated the potential of AI to accelerate design activities and improve engineer
efficiency,” said Daniel Gheno, senior vice president, Innovation and Technology EM at
Schneider Electric. “The next frontier is to combine design automation with engineering expertise,
enabling companies to capture decades of know-how and make robust design decisions available to
every engineer. We believe this is where AI can truly transform electronic design.”
