HomeNewsIndia NewsGlass-on-glass lamination for large-area OLEDs right from the roll

    Glass-on-glass lamination for large-area OLEDs right from the roll

    large-area OLEDs

    The Fraunhofer Institute for Organic Electronics, Electron Beam and Plasma Technology FEP will be presenting flexible organic light-emitting diodes (OLEDs) at AIMCAL 2016 in Dresden, Germany, from May 30th to June 2nd, 2016. These OLEDs have been fabricated on ultra-thin glass and encapsulated with a ultra-thin glass foil in the same process.

    Organic light-emitting diodes have already found acceptance as a light source in first luminaires on the market on rigid glass. However, far larger shares of the market could be acquired, if flexible large-area OLEDs could be manufactured cost-effectively with consistent quality.

    Glass-on-glass laminated OLED made using the Fraunhofer FEP roll-to-roll OLED process line

    Scientists are working feverishly on this worldwide. Large-area OLEDs could be employed not only in innovative furniture designs, but also deliver good service in other sectors requiring specialized curved design, such as architectural lighting and automotive, for example.

    The organic layers of the OLED are sensitive to oxygen and moisture and needs to be well protected. Flexible ultra-thin glass meets the stringent requirements of a hermetic barrier, free of defects and pinhole freedom for large OLED emissive surfaces.

    This adhesive glass film is subsequently laminated to the OLED-coated ultra-thin glass. Fraunhofer FEP will be presenting this type of OLED at AIMCAL 2016, in this case based on G-Leaf™ ultra-thin glass by Nippon Electric Glass Co Ltd. (NEG). 10 cm × 25 cm emissive surfaces will be on display.

    “But encapsulation is not the only challenge for flexible large area OLEDs that need to remain stable over long periods. In order to get them to emit, a highly conductive, transparent oxide layer with good light coupling properties is required and reliable electrical contacts to the emitting layers with low contact resistance is essential,” explains Dr. Stefan Mogck, Head of Roll-to-Roll Organic Technology at Fraunhofer FEP. “We are proud of having optimized our process, and that these layers can be applied very homogenously to the flexible glass.”

    Making dependable electrical connections to the ultra-thin glass without damaging it was especially challenging. The scientists will be working with customers in the future on non-destructive techniques of integration.

    Fraunhofer FEP offers its industrial partners process and product development over the complete value chain customized to their requirements. Processes for treatment and coating flexible glass for customer-specific emissive surfaces in different sizes and colors can be developed, and even flexible OLED prototypes fabricated at customers’ requests. In addition, the Institute can develop matching driver circuitry for supplying power to the prototypes.

    ELE Times Bureau
    ELE Times Bureauhttps://www.eletimes.ai/
    ELE Times provides a comprehensive global coverage of Electronics, Technology and the Market. In addition to providing in depth articles, ELE Times attracts the industry’s largest, qualified and highly engaged audiences, who appreciate our timely, relevant content and popular formats. ELE Times helps you build awareness, drive traffic, communicate your offerings to right audience, generate leads and sell your products better.

    Related News

    Must Read

    What is Fashion Tech? Providing New Product Value and Customer Experiences with Technology

    Courtesy: Murata Electronics What is fashion tech? - diverse technologies...

    Emergency Screaming Detection: How AI Recognizes Human Screams and Saves Lives

    Courtesy: Renesas Detecting human screams for help is important in...

    India’s Electronics Push: Ambition Is Clear. Execution Will Decide the Outcome

    India’s electronics story has entered a decisive phase. The...

    India on the Road to Semicon Self-Reliance with Three More Plants

    India to welcome three more semiconductor plants after PM...

    Upcoming years to Bring Boom for Semiconductors and Electronics

    Union Minister for Electronics and Information Technology Ashwini Vaishnaw...

    R&S Propels 6G Readiness With FR1–FR3 Carrier Demonstration

    Rohde & Schwarz and Qualcomm Technologies, Inc. have reached...

    ROHM and Suchi Semicon Establish a Strategic Semicon Manufacturing Partnership in India

    ROHM and Suchi Semicon have announced the establishment of...

    Keysight to Demonstrate NR-NTN devices Mobility Testing at MWC 2026 in Collaboration with Samsung

    Keysight Technologies, Inc. will demonstrate lab-based validation of new...

    ROHM Strengthens Supply Capability for GaN Power Devices

    Combining TSMC’s Process Technology to Build an End-to-End, In-Group...