HomeNewsIndia NewsXilinx Unveils Disruptive Integration and Architectural Breakthrough for 5G Wireless with...

    Xilinx Unveils Disruptive Integration and Architectural Breakthrough for 5G Wireless with RF-Class Analog Technology

    Xilinx, Inc. recently announced a disruptive integration and architectural breakthrough for 5G wireless with the infusion of RF-class analog technology into its 16nm All Programmable MPSoCs. Xilinx’s new All Programmable RFSoCs eliminate discrete data converters, providing 50-75% power and footprint reduction for 5G massive-MIMO and millimeter wave wireless backhaul applications.

    Large scale 2D antenna array systems will be key to the increase in spectral efficiency and network densification needed for 5G. Manufacturers must find new ways to meet stringent requirements for commercial deployment. With the integration of high performance ADCs and DACs in an All Programmable SoC, radio and wireless backhaul units can now meet previously unattainable power and form factor requirements, while increasing channel density. Additionally, RFSoC devices allow manufactures to streamline design and development cycles to meet 5G deployment timelines.

    The integrated 16nm-based RF data conversion technology includes:

    • Direct RF sampling for simplified analog design, greater accuracy, smaller form factor, and lower power
    • 12-bit ADCs at up to 4GSPS, high channel count, with digital down-conversion
    • 14-bit DACs at up to 6.4GSPS, high channel count, with digital up conversion

    “The shift to FinFET technology blends high integration density with improvements in analog device performance characteristics,” said Boris Murmann, Professor of Electrical Engineering at Stanford University. “This enables the integration of leading-edge analog/RF macros using a digitally assisted analog design approach.”

    “The RFSoC solution from Xilinx is a game changer in the RRU/massive MIMO active antenna array market,” said Earl Lum, President, EJL Wireless Research. “It also allows the company to become the preferred digital solution provider to this market for current and next generation 4G, 4.5G and 5G wireless networks.”

    “Integrating RF signal processing into All Programmable SoCs enables our customers to dramatically change their systems architectures. It also continues the Xilinx imperative for continuous, breakthroughs in system integration,” said Liam Madden, Corporate Vice President, FPGA Development and Silicon Technology at Xilinx. “This will effectively enable our 5G customers to commercially deploy highly differentiated, large-scale, massive-MIMO and millimeter-wave backhaul systems. Our new RFSoC architecture comes at the perfect time, addressing this urgent problem in 5G development.”

    To learn more about the All Programmable RFSoC architecture visit: www.xilinx.com/rfsoc

    ELE Times Bureau
    ELE Times Bureauhttps://www.eletimes.ai/
    ELE Times provides a comprehensive global coverage of Electronics, Technology and the Market. In addition to providing in depth articles, ELE Times attracts the industry’s largest, qualified and highly engaged audiences, who appreciate our timely, relevant content and popular formats. ELE Times helps you build awareness, drive traffic, communicate your offerings to right audience, generate leads and sell your products better.

    LEAVE A REPLY

    Please enter your comment!
    Please enter your name here

    Related News

    Must Read

    Optimized analog front-end design for edge AI

    Courtesy: Avnet Key Takeaways: 01.   AI models see data differently: what...

    Introducing Wi-Fi 8: The Next Boost for the Wireless AI Edge

    Courtesy: Broadcom Wi-Fi 8 has officially arrived—and it marks a...

    Vehicle to Grid (V2G) Charging in EVs: Understanding the Basics

    Much of the research around emerging technologies in Electric...

    Asia-Pacific Takes the Lead in AI Adoption Across Manufacturing

    Courtesy: Rockwell Automation Manufacturing around the world has undergone a...

    STMicroelectronics streamlines smart-home device integration with industry-first Matter NFC chip

    STMicroelectronics has unveiled a secure NFC chip designed to...

    Mitsubishi Electric India to Showcase Breakthrough Power Semiconductor Technologies at PCIM India 2025

    Mitsubishi Electric India, is set to introduce its flagship...

    ASMPT Wins New Orders for Nineteen Chip-to-Substrate TCB Tools to Serve AI Chip Market

    ASMPT announced it had won new orders for 19...

    Microchip Halves the Power Required to Measure How Much Power Portable Devices Consume

    Battery-operated devices and energy-restricted applications must track and monitor...