HomeNewsIndia NewsSoon Experience More Speed, Compactness and Powerful Electronic Devices

    Soon Experience More Speed, Compactness and Powerful Electronic Devices

    The semiconductor material is a backbone of electronics industry, it not only changes the properties but effects overall cost of the product. A good news for the researcher who always looks for the perfect material to start a new innovation and manufacturer whose main concern is to catch up with cost and product.

    Nano scale thin, new material soon will be in the market with highest conductivity and wide band gap which are jointly rare to achieve. The new material as according to researchers of university of Minnesota in US, will be used as the optically transparent conducting film which is different from its counterpart as others include a chemical named indium. Researchers have developed this new material by using a novel synthesis method, in which they have replaced tin source with chemical precursor of tin and grew BaSnO3 thin film. The key area of this new material will include devices which function by the passage of light like touchscreen, solar cell, electronics display, and high power electronics.  Researchers are excited to see their innovation turn into reality with using tin chemical precursor very first time.

    ELE Times Bureau
    ELE Times Bureauhttps://www.eletimes.ai/
    ELE Times provides a comprehensive global coverage of Electronics, Technology and the Market. In addition to providing in depth articles, ELE Times attracts the industry’s largest, qualified and highly engaged audiences, who appreciate our timely, relevant content and popular formats. ELE Times helps you build awareness, drive traffic, communicate your offerings to right audience, generate leads and sell your products better.

    LEAVE A REPLY

    Please enter your comment!
    Please enter your name here

    Related News

    Must Read

    TI’s new power-management solutions enable scalable AI infrastructures

    Texas Instruments (TI) debuted new design resources and power-management...

    ESA awards Rohde & Schwarz for contributions to 30 years European Satellite Navigation

    The event brought together institutional and industrial partners, ESA...

    STMicroelectronics joins FiRa board, strengthening commitment to UWB ecosystem and automotive Digital Key adoption

    STMicroelectronics, a global semiconductor leader serving customers across the...

    STARLight Project chosen as the European consortium to lead in next-gen silicon photonics on 300 mm wafers

    The STARLight project is bringing together a consortium of leading...

    KYOCERA AVX RELEASES NEW KGP SERIES STACKED CAPACITORS

    KYOCERA AVX released the new KGP Series commercial-grade stacked...

    Microchip Unveils First 3 nm PCIe Gen 6 Switch to Power Modern AI Infrastructure

    Switchtec Gen 6 PCIe Fanout Switches deliver extra bandwidth,...

    Nuvoton Launches Arbel NPCM8mnx System-in-Package (SiP) for AI Servers and Datacenter Infrastructure

    Breakthrough BMC Innovation Powers Secure, Scalable, and Open Compute...

    NEPCON ASIA 2025: Showcasing the Future of Smart Electronics Manufacturing

    NEPCON ASIA 2025, taking place from October 28 to...

    Renesas Expands Sensing Portfolio with 3 Magnet-Free IPS ICs & Web-Based Design Tool

    New Simulation & Optimization Platform Enables Custom Coil Designs...

    IEEE IEDM, 2025 Showcases Latest Technologies in Microelectronics, Themed “100 Years of FETs”

    The IEEE International Electron Devices Meeting (IEDM) is considered...