PCB

    8 Reasons to Choose a System on Module in Your Next Product Design

    System on Modules (SoMs) are small, integrated printed circuit boards (PCBs), that contain all of the core components required for an embedded system design,...

    The World’s First GaN-on-GaN Technology and the Imminent Power Systems

    The introduction of the mercury arc rectifier by Peter Cooper Hewitt in 1902 marks the emergence of power electronics. Then gradually evolve with triodes,...

    MIKROE’s 8th Gen Development Board

    MikroElektronika (MIKROE), the embedded solutions company that dramatically cuts development time by providing innovative hardware and software products based on proven standards, has released...

    Allegro MicroSystems Expands Portfolio of Three-Phase Sensorless BLDC Gate Drivers

    Allegro MicroSystems, Inc. today announced it has expanded its portfolio of three-phase sensorless BLDC gate drivers. Its newest offerings, the A89332 and A89332-1, are...

    Replacing Built-in Cables with Flexible Printed Circuits

    With rapid developments taking place in aircraft design in the move towards more sustainable flight, saving weight and space has become more crucial than...

    Substantial Design Productivity with 3D IC Tools and Methodologies

    Transitioning from 2D to 3D IC architectures is not as simple as creating multiple systems-on-chips (SoCs) and blindly stacking them together. There is a...

    Infineon’s New Generation MOTIX Single Half-Bridge ICs Come in a 60 Percent Smaller Package while...

    Infineon Technologies AG presents the new MOTIX BTN99xx (NovalithIC+), a unique family of intelligent integrated half-bridges and the direct successor to the BTN89xx. Besides...

    Pick-n-Place with a One-Two Punch and more from Hanwha at APEX

    Hanwha Techwin Automation Americas, formerly Samsung C&T Automation, will be showcasing award-winning machinery for PCB assembly applications in Booth #611 at the IPC APEX...

    Dixon Forms JV with Japan’s Rexxam to Manufacture Printed Circuit Boards

    Dixon Technologies, a contract manufacturer in electronic goods, on Wednesday, said it has entered into a joint venture with Japan-based Rexxam Co Ltd for manufacturing...

    Moore’s Law and beyond: Advanced 3D ICs and New Architectures

    As we try to increase the efficiency and performance of chips, it is getting more and more complex. But the new architecture of 3D...

    Microchip Adds Second Development Tool Offering for Designers Using Its Low-Power PolarFire RISC-V SoC FPGA...

    Microchip Technology today announced the second development tool offering in its Smart Embedded Vision initiative for designers using its PolarFire RISC-V System on Chip (SoC) Field...

    Launch of New Generation Battery Monitoring ICs for Automotive

    Benefit Enhanced redundancy measurement system and communication function to facilitate development and design of BMS compliant with ASIL-D of in-vehicle functional safety standard (ISO26262). ...

    PCBASupplies to Represent Its Full Line of PCB Assembly Products at SMTA Austin

    PCBASupplies.com is pleased to announce that it will exhibit with Southwest Systems Technology at the SMTA Austin Expo & Tech Forum. The event is...

    Cadence Accelerates System Innovation with Breakthrough Integrity 3D-IC Platform

    Cadence Design Systems, Inc. today announced the delivery of the CadenceÒ IntegrityÔ 3D-IC platform, the industry’s first comprehensive, high-capacity 3D-IC platform that integrates 3D...

    Solderstar Introduces its Newest Thermal Profile -Solutions for the First Time at Productronica

    Solderstar Ltd. will attend its first trade exhibition since the Covid-19 pandemic began. They will present their latest range of thermal profiling solutions to...

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