HomeElectronicsConnectorsIntroducing the Kvaser U100, The New Reference in Rugged CAN Interface Design

    Introducing the Kvaser U100, The New Reference in Rugged CAN Interface Design

    Kvaser AB unveiled the Kvaser U100, a robust, single-channel CAN/CAN FD to USB interface with reinforced galvanic isolation. Compatible with J1939, CANopen, NMEA 2000® and DeviceNet, this is the first of a range of interfaces suited to rugged applications in automotive, marine, industrial, heavy-duty vehicle and heavy industries.

    “The U100 involved a ground-up redesign of our popular rugged Leaf CAN to USB interface to respond to a wider incidence of higher voltage environments and new cost-of-ownership and sustainability criteria from OEMS,” states Ludvig Wallander, Director of Product Development for Kvaser AB.

    “Support feedback suggested that customers with harsh environmental requirements chose entry-level products over high-end, rugged versions because of the price difference,” Wallander continues. “The Kvaser U100 represents a significant achievement in terms of value to the end-user, with features such as higher temperature range and CAN-FD compatibility now available at a much lower cost.”

    With enhanced protection of its own electrical circuits, vibration, shock and drop-proof housing and high-quality cabling, the Kvaser U100 establish a new reference in CAN interface design. Connected to a system with different electrical potentials, the Kvaser U100 mitigates the risk of disturbance caused by current leakage to measurements on the system under test. Able to withstand voltage stress over a much longer timescale than equivalent interfaces, the Kvaser is both electrically and physically robust.

    Innovations include two highly visible LED bars showing CAN traffic status: busload, error frames and overrun. The U100 also features a robust connector with an inverted strain release that handles more force than previous models when pulled or bent. PC- or CANbus- side cable replacement can be carried out by an authorised Kvaser party without compromising IP67 integrity, reducing cost over the product’s lifecycle and enabling fast delivery of custom configurations.

    The Kvaser U100 (EAN 73-30130-01173-1) has a 9-pin D-SUB connector. Other members of the product line with J1939-13 Type II (01266-0), M12 (01267-7) and OBD-II (01268-4) connectors will be available soon.

    Key features of the Kvaser U100

    • Supports CAN FD, up to 8 Mbit/s (with correct physical layer implementation)
    • Electrical robustness: Reinforced galvanic isolation, design validated with 5000 VAC RMS applied for 60 seconds
    • Physical robustness: IP67 rated, rugged housing; −40 oC to +85 oC
    • DB-9 connector
    • Intuitive LED UI
    • 20,000 msg/s, each time stamped with a resolution of 100 μs
    • Supported on Windows and Linux (incl. SocketCAN)
    • Compatible with J1939, CANopen, NMEA 2000® and DeviceNet
    • Fully compatible with applications written for other Kvaser CAN hardware with Kvaser CANlib

    More information can be found at www.kvaser.com/product/kvaser-u100/. The Kvaser U100 can be ordered directly from Kvaser or through one of the company’s authorized sales representatives.

    For more information, visit www.kvaser.com

    ELE Times Report
    ELE Times Reporthttps://www.eletimes.ai/
    ELE Times provides extensive global coverage of Electronics, Technology and the Market. In addition to providing in-depth articles, ELE Times attracts the industry’s largest, qualified and highly engaged audiences, who appreciate our timely, relevant content and popular formats. ELE Times helps you build experience, drive traffic, communicate your contributions to the right audience, generate leads and market your products favourably.

    Related News

    Must Read

    TI’s new power-management solutions enable scalable AI infrastructures

    Texas Instruments (TI) debuted new design resources and power-management...

    ESA awards Rohde & Schwarz for contributions to 30 years European Satellite Navigation

    The event brought together institutional and industrial partners, ESA...

    STMicroelectronics joins FiRa board, strengthening commitment to UWB ecosystem and automotive Digital Key adoption

    STMicroelectronics, a global semiconductor leader serving customers across the...

    STARLight Project chosen as the European consortium to lead in next-gen silicon photonics on 300 mm wafers

    The STARLight project is bringing together a consortium of leading...

    KYOCERA AVX RELEASES NEW KGP SERIES STACKED CAPACITORS

    KYOCERA AVX released the new KGP Series commercial-grade stacked...

    Microchip Unveils First 3 nm PCIe Gen 6 Switch to Power Modern AI Infrastructure

    Switchtec Gen 6 PCIe Fanout Switches deliver extra bandwidth,...

    Nuvoton Launches Arbel NPCM8mnx System-in-Package (SiP) for AI Servers and Datacenter Infrastructure

    Breakthrough BMC Innovation Powers Secure, Scalable, and Open Compute...

    NEPCON ASIA 2025: Showcasing the Future of Smart Electronics Manufacturing

    NEPCON ASIA 2025, taking place from October 28 to...

    Renesas Expands Sensing Portfolio with 3 Magnet-Free IPS ICs & Web-Based Design Tool

    New Simulation & Optimization Platform Enables Custom Coil Designs...

    IEEE IEDM, 2025 Showcases Latest Technologies in Microelectronics, Themed “100 Years of FETs”

    The IEEE International Electron Devices Meeting (IEDM) is considered...