HomeElectronicsSemiconductors and ChipsLIGENTEC and X-FAB Collaboration Creates Europe’s Largest Capacity Foundry Service for Integrated...

LIGENTEC and X-FAB Collaboration Creates Europe’s Largest Capacity Foundry Service for Integrated Photonic Circuits

LIGENTEC, pioneer in high-performance, low-loss, silicon nitride photonic solutions, and specialty semiconductor producer X-FAB Silicon Foundries have announced a strategic partnership resulting in the large-scale supply of integrated photonic devices.

Photonic integrated circuits (PICs) are set to repeat the success story of electronic integrated circuits (ICs). Working with light instead of electrons, PICs will play a key role in tomorrow’s infrastructure for communication, biosensing and transportation.

“Silicon nitride offers superior performance to manage the light in the chip circuitry, with unprecedented low propagation losses and high-power handling,” states Michael Zervas, co-founder of LIGENTEC. “While there is growing worldwide demand for silicon nitride PICs, the missing piece is a commercial volume foundry that can keep pace with the expected uptake.”

LIGENTEC has implemented its proprietary, patented, low-loss silicon nitride process technology within X-FAB’s existing high-throughput foundry workflow. It means that  LIGENTEC PICs are now commercially available in high volumes out of Europe, a key requisite enabling the secure and independent supply of the quantities foreseen in relation to sensors for self-driving cars, environment monitoring, quantum computers and an array of other applications.

“This partnership allows us to offer the benefits of our technology to high volume customers,” says LIGENTEC’s Director Thomas Hessler. “X-FAB’s advanced equipment and superior process control will enable us to serve the mass market with elevated performance PICs. Its multiple sites and capacity to deal with 100,000 new 200 mm wafer starts per month gives exceptional supply

assurance and almost limitless scope for scaling. The proven track record X-FAB has in the automotive and medical sectors will open up new opportunities for LIGENTEC.”

“The integrated photonics market has huge potential. We have partnered with LIGENTEC because it has the highest performance and the most mature offering for passive PICs. This is complemented by a great customer orientation and strong development pipeline, rooted in the company’s long-term R&D relationship with EPFL in Lausanne. We are highly committed to exploring the future possibilities of PICs through our partnership with LIGENTEC, acting as a pillar of strong growth for X-FAB’s specialty foundry business,” adds Rudi De Winter, CEO of X-FAB.

Related News

Must Read

Keysight Expands PCIe 7.0 Test Portfolio with New Receiver Stress Calibration

Keysight Technologies today announces a new PCIe 7.0 Receiver...

VETH100A1DD1 ESD Protection Diode Passes IEEE 10BASE-T1S Compliance Tests

The Vishay Semiconductor VETH100A1DD1 ESD has successfully passed IEEE...

Union Cabinet Authorises Two New Semiconductor Units With an Incremental Investment of Rs. 3,936 Crore

The Union Cabinet approves two more semiconductor projects under...

Arrow Electronics Launches Web-based “Digital Test Drive” to Streamline Hardware Testing

Arrow Electronics today announced the launch of Digital Test...

From Updates to Intelligence: How OTA, Data, and Ethernet Are Reshaping Vehicles

In an exclusive interview with ELE Times, Shrikant Acharya,...

Exploring The Surreality Of High-End Manufacturing On Indian Soil With Sudhir Tangri And Takuya Furata From Keysight

As Keysight explores localization and diversification opportunities through its...