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element14 Community launches smart security and surveillance design challenge

element14, an Avnet Community, in collaboration with ADI, has launched a new design challenge inviting engineers and makers to develop advanced security and surveillance...

R & S and LITEON demonstrate high‑throughput 5G femtocell testing with the PVT360A

Rohde & Schwarz and LITEON collaborate to showcase a production-optimised test setup for high-throughput multi-device testing at MWC Barcelona 2026. The demonstration will feature...

Infineon presents MCU and sensor solutions for the future of AI, IoT, mobility, and robotics

Next-generation embedded systems are essential for applications in the rapidly evolving connected world. They range from high-performance sensors for capturing critical data to advanced...

R&S advances AI-RAN testing using digital twins in collaboration with NVIDIA

Rohde & Schwarz will showcase a new milestone in AI-driven wireless system testing at MWC Barcelona. The testbed, developed in collaboration with NVIDIA, integrates...

NanoXplore & STMicroelectronics deliver European FPGA for space missions, first to qualify to new European...

NanoXplore, the European leader in the design of SoC FPGA and radiation-hardened FPGA technologies, and STMicroelectronics, a global semiconductor leader serving customers across the...

R&S and Broadcom showcase first Wi-Fi 8 RF signalling tests, paving way for next-gen connectivity

Rohde & Schwarz, in collaboration with Broadcom, is set to display its CMX500 multi-technology multi-channel signalling tester at MWC Barcelona 2026 with newly added...

Keysight launches next-gen Infiniium XR8 Oscilloscopes for faster analysis, clearer insights, and a compact design

 Keysight Technologies introduced its next-generation Infiniium XR8 Real-Time oscilloscopes, designed to accelerate high-speed digital and compliance testing while improving efficiency and insight for modern...

R&S showcases its comprehensive embedded systems test solutions at embedded world 2026

Rohde & Schwarz will present its advanced test and measurement solutions for the embedded industry at embedded world Exhibition & Conference in Nuremberg, Germany. Visitors can...

Toxics Link study Finds a Long Road to Circularity in India’s E-waste EPR Model

A new report by an environmental group, Toxics Link, reveals significant structural gaps in India’s Extended Producer Responsibility (EPR) framework for e-waste. The study,...

Keysight Unveils 3D Interconnect Designer for Chiplet and 3DIC Advanced Package Designs

 Keysight Technologies introduced 3D Interconnect Designer, a new addition to its Electronic Design Automation (EDA) portfolio. The solution addresses the mounting complexity of designing 3D...

Jodi Shelton, CEO of GSA – Launches A Bit Personal, a New Podcast Offering Rare,...

Jodi Shelton, Co-Founder and CEO of the Global Semiconductor Alliance and Shelton Group, announced the launch of A Bit Personal, a new leadership-focused podcast that pulls back...

ROHM’s New Compact, Highly Reliable Package Added to Automotive 40V/60V MOSFET Lineup

ROHM has expanded its lineup of low-voltage (40V/60V) MOSFETs for automotive applications – such as main inverter control circuits, electric pumps, and LED headlights...

IIIT Hyderabad’s Smart Approach To Sand Mining Enforcement, Incorporating AI in Trucks

‘Truck art’ or the hand-painted ‘Horn Ok Please’, ‘Use Dipper at Night’ and the ‘Buri nazar waale tera mooh kala’ are an integral part...

Applied Materials, CG Power, Lam Research, Larsen & Toubro, and Micron Join the IDTA

The India Deep Tech Alliance (IDTA) announced that Applied Materials, CG Power, Lam Research, Larsen & Toubro, and Micron Technology have joined the Alliance....

IIIT Hyderabad’s customised chip design and millimetre-wave circuits for privacy-preserving sensing and intelligent healthcare systems

In an age where governance, healthcare and mobility increasingly rely on data, how that data is sensed, processed and protected matters deeply. Visual dashboards,...

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