Press Release

Nuvoton Technology Ushers in a New Era of Edge Computing with the Introduction of the...

Nuvoton Technology, a leading global semiconductor technology provider, proudly announces its latest groundbreaking product – the eBMC chip. This innovative product, specially designed for...

TI expands low-power GaN portfolio, enabling AC/DC power adapters to shrink 50%

Engineers can develop AC/DC solutions that are half the size and achieve >95% system efficiency, simplifying thermal design. New GaN devices are compatible...

New Energy Collaborative Aims to Accelerate Creation of Low-Carbon Energy Access in Asia-Pacific for the...

Energy Collaborative to highlight initial sponsors, partners and mission at COP28 2023 United Nations Climate Change Conference Aiming to reduce global semiconductor ecosystem carbon emissions,...

Speed and Precision for SiPs

The SIPLACE TX micron is the answer to the challenges manufacturers face in SiP (system-in-package) production. The flexible platform combines the speed of SMT...

India Set to Welcome Three New Semiconductor Facilities and AMD’s Design Center

In a recent announcement, the Union Minister for Electronics and IT, Ashwini Vaishnaw, disclosed that India is poised to witness the establishment of three...

Infineon introduces the first 15 V trench power MOSFETs with OptiMOS 7 technology in PQFN...

The ever-increasing power demand in data centers and computing applications requires advancements in power efficiency and compact power supply design. Infineon Technologies AG responds...

Unique Rohde & Schwarz 170 GHz power sensors ease use and traceability in the D-band

Rohde & Schwarz is launching the new R&S NRP170TWG(N) thermal power sensor for precise power level measurements in the D-band. It is the only...

Infineon introduces the industry’s first USB 10 Gbps peripheral controller

The EZ-USB family of programmable USB peripheral controllers has continuously advanced features and performance, enabling developers to create USB devices that meet the highest...

Gartner Says Cloud Will Become a Business Necessity by 2028

Global Public Cloud Services Spending to Total $679 Billion in 2024 By 2028, cloud computing will shift from being a technology disruptor to becoming a...

Microchip Unveils New Standard of Enhanced Code Security With The PIC18-Q24 Family of MCUs

Added voltage level shifting capabilities help increase flexibility and reduce system costs More and more everyday items are connected to the cloud—from cellphones and vehicles...

“Coil on Module” enables ultra-thin electronic data page for Turkish passports with exceptional document durability...

Türkiye has issued nearly five million nextgeneration electronic passports with contactless Coil on Module (CoM CL) solution from Infineon Technologies AG. The passport includes...

DIGISEQ and Infineon support market growth of wearables by launching world-first pre-certified ring inlay

Munich, Germany, and London, UK DIGISEQ Ltd, the wearable payment tech pioneer, has received Mastercard certification for a world-first pre-certified concentric ring inlay, opening...

GOEPEL Electronics LLC strengthens its team with experienced sales expert

The US branch of GÖPEL electronic is proud to announce the addition of Mr. David Kalaidjian as the new National Sales Development Manager. Mr....

Infineon @ TRUSTECH 2023: Mini airport booth displays TEGRION and SECORA Pay demos for high...

At TRUSTECH, the tradeshow for innovative payment and identification solutions, Infineon Technologies AG will present the latest member of the TEGRION family, which accelerates...

ETAS and Infineon receive NIST CAVP certification for ESCRYPT CycurHSM implemented on AURIX microcontrollers

ETAS GmbH, a leading solution provider for Software Defined Vehicles (SDV), and Infineon Technologies have successfully certified their cryptographic algorithm suite. The certificate was...

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