HomeElectronicsTest and MeasurementRohde & Schwarz and MediaTek verify 5G LBS Release 16 features on...

    Rohde & Schwarz and MediaTek verify 5G LBS Release 16 features on the R&S TS-LBS Test Solution

    Rohde & Schwarz and MediaTek are further advancing LBS testing with the successful verification of 3GPP Release 16 positioning features on a 5G chipset from MediaTek using the R&STS-LBS test system. The two companies verified the NR positioning reference signals (NR-PRS), which are central to network-based positioning features, such as roundtrip time (RTT), time difference of arrival in uplink and downlink (UL-TDOA and DL-TDOA), or angle of arrival and departure (AoA and AoD), and which meet the 5G requirements for indoor and outdoor positioning use cases. With the new option for the R&S TS-LBS supporting these features, mobile device and chipset manufacturers, test houses and network operators are able to carry out chipset and mobile device verification for GCF, PTCRB and network operator certification, using a single test solution.

    The R&S TS-LBS is a test system for testing GNSS and network-based positioning. It consists of an R&SCMX500 OBT one-box signaling tester as the network simulator and an R&SSMBV100B GNSS simulator. The R&S CMX500 OBT setup provides full network simulation capabilities including the support of multiple 4G or 5G cells at a time. In addition, it provides LBS assistance data to the DUT while the R&S SMBV100B simulates the GNSS satellites. The R&S TS-LBS test system can be used for R&D-related pre-conformance tests and to obtain GCF and PTCRB certification as well as network operator specific certification acceptance and validated tests.

    Christoph Pointner, Senior Vice President Mobile Radio Testers at Rohde & Schwarz, says: “Adding network-based positioning features such as DL-TDOA based on NR-PRS to the existing satellite-based location signals shows the advanced level of our test solution. We are happy to continue our collaboration with MediaTek to push 5G location-based services further for 3GPP Release 16.”

    For more information on the R&S TS-LBS test system, visit: R&S®TS-LBS

    ELE Times News
    ELE Times Newshttps://www.eletimes.ai/
    ELE Times provides extensive global coverage of Electronics, Technology, and the Market. In addition to providing in-depth articles, ELE Times attracts the industry’s largest, qualified, and highly engaged audiences, who appreciate our timely, relevant content and popular formats. ELE Times helps you build experience, drive traffic, communicate your contributions to the right audience, generate leads, and market your products favorably.

    Related News

    Must Read

    Optimized analog front-end design for edge AI

    Courtesy: Avnet Key Takeaways: 01.   AI models see data differently: what...

    Introducing Wi-Fi 8: The Next Boost for the Wireless AI Edge

    Courtesy: Broadcom Wi-Fi 8 has officially arrived—and it marks a...

    Vehicle to Grid (V2G) Charging in EVs: Understanding the Basics

    Much of the research around emerging technologies in Electric...

    Asia-Pacific Takes the Lead in AI Adoption Across Manufacturing

    Courtesy: Rockwell Automation Manufacturing around the world has undergone a...

    STMicroelectronics streamlines smart-home device integration with industry-first Matter NFC chip

    STMicroelectronics has unveiled a secure NFC chip designed to...

    Mitsubishi Electric India to Showcase Breakthrough Power Semiconductor Technologies at PCIM India 2025

    Mitsubishi Electric India, is set to introduce its flagship...

    ASMPT Wins New Orders for Nineteen Chip-to-Substrate TCB Tools to Serve AI Chip Market

    ASMPT announced it had won new orders for 19...

    Microchip Halves the Power Required to Measure How Much Power Portable Devices Consume

    Battery-operated devices and energy-restricted applications must track and monitor...