HomeNewsIndia NewsSMP Product line to be expanded with all new termination configurations

    SMP Product line to be expanded with all new termination configurations

    Amphenol RF is proud to announce the latest expansion of the popular SMP product line – a high-frequency, subminiature interconnect solution, to include several new thread-in mount jacks, a straight cable plug and a bullet adapter. This connector series is designed for blind mate applications with a variety of board spacing and package size requirements.

    The three additional SMP straight jacks feature a thread-in bulkhead design with post contacts and push-on coupling mechanism. These 50 ohm connectors are constructed with gold plated brass and are available in limited detent, full detent and smooth bore interfaces.

    A new straight solder plug is optimized for 0.047” semi-rigid cable and is designed with an anti-rock ring for vibration resistance. This connector features the familiar push-on coupling style and is constructed with gold plated beryllium copper.

    The SMP plug to plug bullet adapter is designed to compensate of both radial and axial misalignment and is now available in 17.16 mm length.

    The SMP series operates at DC to 26.5 GHz making this product family ideal for applications that require a high data rate transmission, such as broadband, instrumentation and telecommunications applications.

    For more information, visit: www.amphenolrf.com

    ELE Times Research Desk
    ELE Times Research Deskhttps://www.eletimes.ai
    ELE Times provides a comprehensive global coverage of Electronics, Technology and the Market. In addition to providing in depth articles, ELE Times attracts the industry’s largest, qualified and highly engaged audiences, who appreciate our timely, relevant content and popular formats. ELE Times helps you build awareness, drive traffic, communicate your offerings to right audience, generate leads and sell your products better.

    Related News

    Must Read

    Keysight to Demonstrate NR-NTN devices Mobility Testing at MWC 2026 in Collaboration with Samsung

    Keysight Technologies, Inc. will demonstrate lab-based validation of new...

    ROHM Strengthens Supply Capability for GaN Power Devices

    Combining TSMC’s Process Technology to Build an End-to-End, In-Group...

    element14 Community launches smart security and surveillance design challenge

    element14, an Avnet Community, in collaboration with ADI, has...

    R & S and LITEON demonstrate high‑throughput 5G femtocell testing with the PVT360A

    Rohde & Schwarz and LITEON collaborate to showcase a...

    Infineon presents MCU and sensor solutions for the future of AI, IoT, mobility, and robotics

    Next-generation embedded systems are essential for applications in the...

    R&S advances AI-RAN testing using digital twins in collaboration with NVIDIA

    Rohde & Schwarz will showcase a new milestone in...

    Top Seven Tech Trends in the semiconductor sector for 2026

    By: STMicroelectronics In 2026, a new class of intelligent machines...