HomeNewsIndia NewsThe advent of reconfigurable electronics revolutionizes the wearable, implantable devices

    The advent of reconfigurable electronics revolutionizes the wearable, implantable devices

    In the future, the medical implants may feature reconfigurable electronic platforms that can morph in shape and size dynamically as bodies change or transform to relocate from one area to monitor another within our bodies.

    A silicon-honeycomb-serpentine reconfigurable electronic platform has been reported by a group of researchers from King Abdullah University of Science and University of California, Berkley, which can be morphed dynamically in three different shapes; quatrefoils (four lobes), stars and irregular ones.

    “Quatrefoils can be used for rectangular object-based operation, while stars are for more intricate architectures, and irregular-shaped ones are specifically for implanted bioelectronics,” said Muhammad Hussain, co-author and a visiting professor at the University of California, Berkeley.

    With their work, the researchers are introducing a new branch of flexible, stretchable electronics, opening the door to new engineering challenges and providing opportunities for innovation in biomedical technologies that can be used for drug delivery, health monitoring, diagnosis, therapeutic healing, implants and soft robotics.

    Inspiration for the group’s honeycomb-shaped platform comes from nature. “Think of how flowers bloom. Based on the same principle, we gathered many videos of flowers blossoming, analyzed their geometric pattern and used them for our first set of designs,” Hussain said. “In particular, we analyzed their stress distribution in an iterative manner, taking design architecture, materials and their properties into consideration. It’s a tedious process to reach the optimal balance, but this is where engineering helps.”

    Reconfigurable electronic platforms are designed to undergo physical deformation, such as stretching, bending, folding or twisting to morph into another shape. “Imagine that a lab-on-chip platform is implanted within your body to monitor the growth of a tumor in the shoulder area,” said Hussain. “While it is implanted, if we observe some abnormality in lung function, a platform that is equipped enough can change its shape and size, and relocate or expand to go monitor lung function.”

    Another idea the researchers are actively pursuing is a wearable heart sleeve to monitor heart activity with the ability to mechanically pump the heart by repeated expansion and contraction when needed.

    “We still have a long way to go to integrate soft robotics with embedded high-performance flexible complementary metal-oxide semiconductor (CMOS) electronics on a variety of reconfigurable electronic platforms, which will be of immense importance,” Hussain said. “It offers wonderful engineering challenges, requires true multidisciplinary efforts and has the ability to bind a variety of disciplines into applications that are simply not possible with the existing electronics infrastructure.”

    ELE Times Research Desk
    ELE Times Research Deskhttps://www.eletimes.ai
    ELE Times provides a comprehensive global coverage of Electronics, Technology and the Market. In addition to providing in depth articles, ELE Times attracts the industry’s largest, qualified and highly engaged audiences, who appreciate our timely, relevant content and popular formats. ELE Times helps you build awareness, drive traffic, communicate your offerings to right audience, generate leads and sell your products better.

    LEAVE A REPLY

    Please enter your comment!
    Please enter your name here

    Related News

    Must Read

    TI’s new power-management solutions enable scalable AI infrastructures

    Texas Instruments (TI) debuted new design resources and power-management...

    ESA awards Rohde & Schwarz for contributions to 30 years European Satellite Navigation

    The event brought together institutional and industrial partners, ESA...

    STMicroelectronics joins FiRa board, strengthening commitment to UWB ecosystem and automotive Digital Key adoption

    STMicroelectronics, a global semiconductor leader serving customers across the...

    STARLight Project chosen as the European consortium to lead in next-gen silicon photonics on 300 mm wafers

    The STARLight project is bringing together a consortium of leading...

    KYOCERA AVX RELEASES NEW KGP SERIES STACKED CAPACITORS

    KYOCERA AVX released the new KGP Series commercial-grade stacked...

    Microchip Unveils First 3 nm PCIe Gen 6 Switch to Power Modern AI Infrastructure

    Switchtec Gen 6 PCIe Fanout Switches deliver extra bandwidth,...

    Nuvoton Launches Arbel NPCM8mnx System-in-Package (SiP) for AI Servers and Datacenter Infrastructure

    Breakthrough BMC Innovation Powers Secure, Scalable, and Open Compute...

    NEPCON ASIA 2025: Showcasing the Future of Smart Electronics Manufacturing

    NEPCON ASIA 2025, taking place from October 28 to...

    Renesas Expands Sensing Portfolio with 3 Magnet-Free IPS ICs & Web-Based Design Tool

    New Simulation & Optimization Platform Enables Custom Coil Designs...

    IEEE IEDM, 2025 Showcases Latest Technologies in Microelectronics, Themed “100 Years of FETs”

    The IEEE International Electron Devices Meeting (IEDM) is considered...